2SCR564F3
小型化、高散熱性封裝，NPN 4A 80V 中功率電晶體
2SCR564F3
2SCR564F3
小型化、高散熱性封裝，NPN 4A 80V 中功率電晶體
2SCR564F3是低VCE(sat)的中功率電晶體，適合低頻放大用途。採用熱導率、導電率優異的無引線小型表面安裝封裝HUML2020L3(DFN2020-3S)。
Product Detail
規格:
Package Code
DFN2020-3S
Number of terminal
3
Polarity
NPN
Collector Power dissipation PC[W]
1
Collector-Emitter voltage VCEO1[V]
80
Collector current Io(Ic) [A]
4
hFE
120 to 390
Mounting Style
Surface mount
Storage Temperature (Min.)[°C]
-55
Storage Temperature (Max.)[°C]
150
Package Size [mm]
2x2 (t=0.65)
功能:
- Suitable for Middle Power Driver.
- Low VCE(sat)
VCE(sat)=300mV(Max.).
(IC/IB=2A/100mA) - High collector current.
IC=4A(max),ICP=8A(max) - Leadless small SMD package (HUML2020L3)
Excellent thermal and electrical conductivity.
