Videos & Catalogs
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X-in-1 HSDIP20 SiC Modules
2025-04-24 00:00:00.0
( 3:13 )
Integrating ROHM SiC MOSFETs, which combine low ON resistance with high-speed switching, into the HSDIP20 package, results in industry-leading current density that enables fast charging.
Integrating ROHM SiC MOSFETs, which combine low ON resistance with high-speed switching, into the HSDIP20 package, results in industry-leading current density that enables fast charging.
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內建SiC MOSFET小型封裝型模組（HSDIP20） - BSTxxx1P4K01, BSTxxx2P4K01
2025-04-24 00:00:00.0
( 1.37 MB )
BSTxxx1P4K01（750V）和BSTxxx2P4K01（1,200V）是內建4顆或6顆SiC MOSFET的封裝型模組。將大功率應用的電源轉換電路中所需的基本電路，集約到小型模組封裝中，助力應用產品小型化。
BSTxxx1P4K01（750V）和BSTxxx2P4K01（1,200V）是內建4顆或6顆SiC MOSFET的封裝型模組。將大功率應用的電源轉換電路中所需的基本電路，集約到小型模組封裝中，助力應用產品小型化。
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Molded Power Modules for Traction Inverter Drive TRCDRIVE pack™ - BSTxxxD12P4Axxx, BSTxxxxD08P4Axxx
2024-06-10 00:00:00.0
( 1.13 MB )
Power module with ultra-high current density and compact easy-to-mount single-sided high heat dissipation molded package.
Power module with ultra-high current density and compact easy-to-mount single-sided high heat dissipation molded package.
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