SCT3030AL
N-channel SiC 功率MOSFET

溝槽閘極構造的SiC-MOSFET。平面型SiC-MOSFET相比,同一芯片尺寸的導通電阻可降低50%,這將大幅降低太陽能發電用功率調節器和工業設備用電源、工業用逆變器等所有相關設備的功率損耗。

Data Sheet 購買 *
* 本產品是標準級的產品。
本產品不建議使用的車載設備。

Product Detail

 
料號 | SCT3030ALGC11
狀態 | 推薦品
封裝 | TO-247N
單位數量 | 450
最小包裝數量 | 30
包裝形式 | Tube
RoHS | Yes

規格:

Drain-source Voltage[V]

650

Drain-source On-state Resistance(Typ.)[mΩ]

30.0

Drain Current[A]

70.0

Total Power Dissipation[W]

262

Junction Temperature(Max.)[°C]

175

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

175

功能:

・ Low on-resistance
・ Fast switching speed
・ Fast reverse recovery
・ Easy to parallel
・ Simple to drive
・ Pb-free lead plating ; RoHS compliant

Design Resources

 

Documents

White Paper

  • Cutting-Edge Web Simulation Tool “ROHM Solution Simulator” Capable of Complete Circuit Verification of Power Devices and Driver ICs
  • LEADRIVE: Design, Test and System Evaluation of Silicon Carbide Power Modules and Motor Control Units
  • Solving the challenges of driving SiC MOSFETs with new packaging developments

Technical Articles

Schematic Design & Verification

  • Calculating Power Loss from Measured Waveforms
  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Precautions during gate-source voltage measurement for SiC MOSFET
  • Snubber circuit design methods for SiC MOSFET
  • Application Note for SiC Power Devices and Modules
  • Gate-source voltage behaviour in a bridge configuration
  • Gate-Source Voltage Surge Suppression Methods
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Thermocouples
  • What is a Thermal Model? (SiC Power Device)
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • How to Use Thermal Models
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Tools

Simulations (Login Required)

  • AC-DC PFC
    Circuit Number A001: BCM VIN=200V IIN=2.5A
  • AC-DC PFC
    Circuit Number A002: BCM Diode-Bridge-Less VIN=200V IIN=2.5A
  • AC-DC PFC
    Circuit Number A004: CCM VIN=200V IIN=2.5A
  • AC-DC PFC
    Circuit Number A005: CCM 2-Phase VIN=200V IIN=5A
  • AC-DC PFC
    Circuit Number A006: CCM Synchro VIN=200V IIN=2.5A
  • AC-DC PFC
    Circuit Number A011: DCM VIN=200V IIN=2.5A
  • AC-DC PFC
    Circuit Number A012: DCM 2-Phase VIN=200V IIN=5A
  • AC-DC PFC
    Circuit Number A014: DCM Synchro VIN=200V IIN=2.5A
  • DC-DC Converter
    Circuit Number C006: Buck Converter Vo=250V Io=20A
  • DC-DC Converter
    Circuit Number C007: Buck Converter 2-Phase Vo=250V Io=40A
  • DC-DC Converter
    Circuit Number C010: Flyback Converter VIN=800V Vo=25V Io=10A
  • DC-DC Converter
    Circuit Number C011: Forward Converter VIN=500V Vo=25V Io=10A
  • DC-DC Converter
    Circuit Number C012: LLC Buck Converter Vo=12V Io=250A
  • DC-DC Converter
    Circuit Number C013: Phase-Shift Buck Converter Vo=12V Io=250A
  • DC-DC Converter
    Circuit Number C014: Quasi-Resonant Converter VIN=800V Vo=25 Io=10A

Models

  • SCT3030AL SPICE Simulation Evaluation Circuit
  • SCT3030AL SPICE Model
  • SCT3030AL Thermal Model (lib)

Characteristics Data

  • ESD Data

Packaging & Quality

Package Information

  • Package Dimensions
  • Inner Structure
  • Taping Information
  • Explanation for Marking
  • Moisture Sensitivity Level
  • Anti-Whisker formation
  • Condition of Soldering

Manufacturing Data

  • Reliability Test Result

Environmental Data

  • Constitution Materials List
  • About Flammability of Materials
  • Compliance of the ELV directive
  • Report of SVHC under REACH Regulation

Export Information

  • About Export Administration Regulations (EAR)