BD63875EFV - 技術資料

此為ROHM步進馬達中最高功能且高可靠性的High grade型。由於採用低Rds ON DMOS和高散熱功率封裝,降低了IC的發熱,並且擁有完整的各種保護電路的系列。具有低耗電雙極型PWM定電流驅動方式的驅動器,額定電壓36V,輸出額定電流爲1.0A~2.2A的基本功能。輸入介面有CLK-IN/PARALLEL-IN可替換型,CLK-IN型和PARALLEL-IN型3種。激磁模式對應FULL STEP、HALF STEP(2種)和QUATER STEP模式。電流衰減方式可自由設定FAST DECAY/SLOW DECAY的比率。能夠達到對所有馬達進行最佳的控制狀態。並且,因爲電源可以單系統驅動,有助於設備的設計更容易進行。

calculator for motor driver junction temperature←Simple calculator for stepper motor driver junction temperature

* 本產品是標準級的產品。本產品不建議使用的車載設備。

User's Guide

RAGU User's Guide (EN)
 
The RAGU is Evaluation Tool controls the stepping motor driver IC to demonstrate and evaluate its functions.

Application Note

Notes for Temperature Measurement Using Thermocouples
 
This application note explains cautions regarding the temperature measurement. The content of this application note is generally applicable, irrespective of the types of semiconductor devices.
Two-Resistor Model for Thermal Simulation
 
This application note explains the two-resistor model, which is the simplest model among thermal models used in thermal simulations. The thermal simulations mentioned three-dimensional model thermal conduction and thermal fluid analysis tools.
Notes for Temperature Measurement Using Forward Voltage of PN Junction
 
This application note explains cautions regarding the temperature measurement Using Forward Voltage of PN Junction. The content of this application note is generally applicable, irrespective of the types of semiconductor devices.
Method for Monitoring Switching Waveform
 
This application note explains how to correctly monitor the switching waveforms of the power device element such as switching power supply or a motor drive circuit.
Importance of Probe Calibration When Measuring Power: Deskew
 
Even when devices used for measurement are calibrated regularly, they will give incorrect results if calibration is not perfo rmed for the measurement environment. This application note explains the importance of probe calibration in power measurement environments.
Thermal Resistance
 
The definition and how to use thermal resistance and thermal characterization parameter of packages for ROHM’s integrated circuit are described in this application note.
Impedance Characteristics of Bypass Capacitor
 
This application note focuses on the impedance characteristics of capacitors, and explains cautions for selecting bypass capacitors.
Precautions When Measuring the Rear of the Package with a Thermocouple
 
This application note describes precautions when measuring the temperature on the rear of a package using a thermocouple to find the junction temperature of a semiconductor chip during actual operation.
Package Ordering Unit
 
For ICs