新設計不推薦
RB218BM200
200V, 20A, 超低IR 蕭特基二極體
新設計不推薦
RB218BM200
200V, 20A, 超低IR 蕭特基二極體
為了既有客戶所需而生產的產品。對於新設計則不予販售。
×
Product Detail
RB218BM200 的替換產品
Part Number |
![]() |
![]() |
![]() |
---|---|---|---|
Ordering Part Number | RB218BM200TL | RB218BM200FNSTL | RB218BM200FHHTL |
Similar Level | - | Same Pinout, Package | Different Grade |
Data Sheet | |||
Supply Status | Not Recommended for New Designs | Recommended | Recommended |
Package | TO-252M | TO-252M | TO-252M |
Unit Quantity | 2500 | 2500 | 2500 |
Minimum Packing Quantity | 2500 | 2500 | 2500 |
Packing Type | Taping | Taping | Taping |
RoHS | Yes | Yes | Yes |
Package Code | TO-252AA (D-PAK) | TO-252AA (D-PAK) | TO-252AA (D-PAK) |
Package Size [mm] | 10.0x6.6 (t=2.3) | 10.0x6.6 (t=2.3) | 10.0x6.6 (t=2.3) |
JEITA Package | SC-63 | SC-63 | SC-63 |
Configuration | C-Common | C-Common | C-Common |
Number of terminal | 3 | 3 | 3 |
VRM [V] | 200 | 200 | 200 |
Reverse Voltage VR [V] | 200 | 200 | 200 |
Average Rectified Forward Current IO [A] | 20.0 | 20.0 | 20.0 |
IFSM [A] | 100.0 | 100.0 | 100.0 |
Forward Voltage VF (Max.)[V] | 0.88 | 0.88 | 0.88 |
IF @ Forward Voltage [A] | 10.0 | 10.0 | 10.0 |
Reverse Current IR (Max.)[mA] | 0.01 | 0.01 | 0.01 |
VR @ Reverse Current[V] | 200 | 200 | 200 |
Tj[?] | 150 | 175 | 175 |
Storage Temperature (Min.)[°C] | -55 | -55 | -55 |
Storage Temperature (Max.)[°C] | 150 | 175 | 175 |
Mounting Style | Surface mount | Surface mount | Surface mount |
Common Standard | - | - | AEC-Q101 (Automotive Grade) |
Part Number |
![]() |
![]() |
![]() |
---|---|---|---|
Ordering Part Number | RB218BM200TL | RB218BM200FNSTL | RB218BM200FHHTL |
Similar Level | - | Same Pinout, Package | Different Grade |
Data Sheet | |||
Supply Status | Not Recommended for New Designs | Recommended | Recommended |
Package | TO-252M | TO-252M | TO-252M |
Unit Quantity | 2500 | 2500 | 2500 |
Minimum Packing Quantity | 2500 | 2500 | 2500 |
Packing Type | Taping | Taping | Taping |
RoHS | Yes | Yes | Yes |
Package Code | TO-252AA (D-PAK) | TO-252AA (D-PAK) | TO-252AA (D-PAK) |
Package Size [mm] | 10.0x6.6 (t=2.3) | 10.0x6.6 (t=2.3) | 10.0x6.6 (t=2.3) |
JEITA Package | SC-63 | SC-63 | SC-63 |
Configuration | C-Common | C-Common | C-Common |
Number of terminal | 3 | 3 | 3 |
VRM [V] | 200 | 200 | 200 |
Reverse Voltage VR [V] | 200 | 200 | 200 |
Average Rectified Forward Current IO [A] | 20.0 | 20.0 | 20.0 |
IFSM [A] | 100.0 | 100.0 | 100.0 |
Forward Voltage VF (Max.)[V] | 0.88 | 0.88 | 0.88 |
IF @ Forward Voltage [A] | 10.0 | 10.0 | 10.0 |
Reverse Current IR (Max.)[mA] | 0.01 | 0.01 | 0.01 |
VR @ Reverse Current[V] | 200 | 200 | 200 |
Tj[?] | 150 | 175 | 175 |
Storage Temperature (Min.)[°C] | -55 | -55 | -55 |
Storage Temperature (Max.)[°C] | 150 | 175 | 175 |
Mounting Style | Surface mount | Surface mount | Surface mount |
Common Standard | - | - | AEC-Q101 (Automotive Grade) |
Design Resources
List View
Search: ×
Documents
Type | Title | Last Updated |
---|---|---|
Data Sheet | 2025/01/15 | |
Application Note | 2024/12/03 |
Software
Title | Description |
---|---|
No data available in table |
Showing 0 to 0 of 0 entries
Technical Articles
Type | Title | Last Updated |
---|---|---|
Technical Article | 2025/04/16 | |
Schematic Design & Verification | 2025/03/06 | |
Schematic Design & Verification | 2024/06/04 | |
Thermal Design | 2024/05/10 | |
White Paper | 2024/03/26 | |
Schematic Design & Verification | 2024/02/13 | |
Technical Article | 2023/12/18 | |
Technical Article | 2023/12/18 | |
Technical Article | 2023/11/17 | |
Thermal Design | 2023/06/08 | |
Thermal Design | 2023/03/08 | |
Thermal Design | 2023/02/24 | |
Thermal Design | 2023/02/13 | |
Thermal Design | 2023/01/20 | |
Schematic Design & Verification | 2023/01/11 | |
Thermal Design | 2022/09/15 | |
Thermal Design | 2022/07/28 | |
Thermal Design | 2022/07/12 | |
Thermal Design | 2022/07/06 | |
Thermal Design | 2021/08/18 | |
Thermal Design | 2021/06/24 | |
Thermal Design | 2021/06/14 | |
Schematic Design & Verification | 2020/12/07 | |
Thermal Design | 2020/10/26 | |
Schematic Design & Verification | 2020/09/16 | |
Thermal Design | 2020/04/20 | |
Thermal Design | 2020/04/09 | |
Thermal Design | 2020/04/09 | |
Thermal Design | 2019/12/27 | |
Schematic Design & Verification | 2019/11/18 |
Brochures
Type | Title | Last Updated |
---|---|---|
No data available in table |
Showing 0 to 0 of 0 entries
Tools
Type | Title | Last Updated |
---|---|---|
Characteristics Data | 2021/06/21 | |
2D/3D/CAD | - |
Packaging & Quality
Type | Title | Last Updated |
---|---|---|
Environmental Data | 2025/05/28 | |
Package Information | 2025/04/22 | |
Package Information | 2025/04/22 | |
Manufacturing Data | 2025/04/18 | |
Package Information | 2016/09/30 | |
Environmental Data | 2016/09/30 | |
Package Information | 2016/09/27 | |
Package Information | 2016/09/27 | |
Package Information | 2016/09/27 | |
Package Information | 2016/09/27 | |
Export Information | 2016/09/27 |
For Promotion
Type | Title | Last Updated |
---|---|---|
No data available in table |
Showing 0 to 0 of 0 entries
Videos & Catalogs
Loading...
影片一覽

性能和封裝陣容豐富 ROHM的Si功率二極體 - Si功率二極體 Best Selection
2025-05-30 00:00:00.0
( 4.33 MB )
ROHM的Si功率二極體擁有豐富的產品陣容和穩定的品質,客戶可根據用途和封裝選擇合適的產品,目前已被眾多客戶採用。ROHM的製造體系從未停止對技術與品質的執著追求,所生產的產品在車載、工業設備及消費電子等眾多應用領域中均可安心使用。
ROHM的Si功率二極體擁有豐富的產品陣容和穩定的品質,客戶可根據用途和封裝選擇合適的產品,目前已被眾多客戶採用。ROHM的製造體系從未停止對技術與品質的執著追求,所生產的產品在車載、工業設備及消費電子等眾多應用領域中均可安心使用。
X