2SAR567F3
小型化、高散熱性封裝,PNP -2.5A -120V 中功率電晶體
2SAR567F3
2SAR567F3
小型化、高散熱性封裝,PNP -2.5A -120V 中功率電晶體
2SAR567F3是低VCE(sat)的中功率電晶體,適合低頻放大用途。採用熱導率、導電率優異的無引線小型表面安裝封裝HUML2020L3(DFN2020-3S)。
Product Detail
規格:
Package Code
DFN2020-3S
Number of terminal
3
Polarity
PNP
Collector Power dissipation PC[W]
1
Collector-Emitter voltage VCEO1[V]
-120
Collector current Io(Ic) [A]
-2.5
hFE
120 to 390
hFE (Min.)
120
hFE (Max.)
390
Mounting Style
Surface mount
Storage Temperature (Min.)[°C]
-55
Storage Temperature (Max.)[°C]
150
Package Size [mm]
2x2 (t=0.65)
功能:
- Suitable for Middle Power Driver.
- Low VCE(sat) VCE(sat)=-200mV (Max.) . (IC/IB=-800mA/-80mA)
- High collector current. IC=-2.5A(max), ICP=-5A(max)
- Leadless small SMD package (HUML2020L3) Excellent thermal and electrical conductivity.