ML22660GD(Taping)
外接記憶體 - 內建AB類/D類揚聲器放大器型
ML22660GD(Taping)
外接記憶體 - 內建AB類/D類揚聲器放大器型
ML22620 / ML22660是一款語音合成LSI，由於可外接最大128 Mbit的串行記憶體，因此非常適合長時間播放。
採用HQ-ADPCM、16位D/A轉換器和低通濾波器，實現高品質音質，並內建1.0W單聲道揚聲器放大器，可直接驅動揚聲器。
由於音訊輸出所需的功能都整合在單一晶片上，只需添加此LSI即可輕鬆實現音訊功能。
Product Detail
規格:
Operating Voltage [V]
2.7 to 3.6 or 3.3 to 5.5
Operating Frequency [MHz]
4.096
4.000
Oscillator
Built-in
External
Operating Temperature (Min.)[°C]
-40
Operating Temperature (Max.)[°C]
85
ROM Capacity [bit]
External maximum 128M
Number of Phrases
4096
Maximum Playback Time ?
109min *1
CPU I/F
I2C
SP Amplifier Output [W] / Class
1.0/AB-class,
D-class
Number of Mixing (Internal) [ch]
4
Others
Failure detection
Automotive Grade
No
AEC-Q100 standard
No
Industrial Grade
Yes
Development Support
-
- Reference Board
- RB-S22660GD32
- Supply Status
- Recommended
- Supporuted LSI
- ML22660 (WQFN32 package)
- Composition
- Reference board with WQFN32 socket and external flash memory
- User's Manual
- Notes
- Used by connecting to SDCB3.
- Reference board for WQFN32 package.
-
- Reference Board
- RB-S22660TB32
- Supply Status
- Recommended
- Supporuted LSI
- ML22660 (TQFP32 package)
- Composition
- Reference board with TQFP32 socket and external flash memory
- User's Manual
- Notes
- Used by connecting to SDCB3.
- Reference board for TQFP32 package.
-
- Development Kit
- SDCK3
- Supply Status
- Recommended
- Supporuted LSI
- ML22530, Q532, Q533, Q535
- ML22620, Q623, Q624, Q625, Q626
- ML22660, Q663, Q664, Q665, Q666
- ML22Q234, Q244, Q254
- ML22Q274, Q284, Q294
- ML22572, 573, Q573, Q553, ML22594
- ML22Q374, Q394
- ML22562, 563, Q563
- ML22823, 824, 825
- ML22863, 864, 865
- Composition
- Sound device control board 3 [SDCB3]
- USB cable
"LAPIS TECHNOLOGY™" is a trademark or a registered trademark of ROHM Co., Ltd.