BSM600D12P3G001
SiC（碳化矽）功率模組

BSM600D12P3G001是由羅姆公司生產的SiC-UMOSFET和SiC-SBD構成的全SiC半橋模組。最適合馬達驅動、逆變器、轉換器、太陽能發電、風力發電及感應加熱裝置等用途。

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* 本產品是標準級的產品。
本產品不建議使用的車載設備。
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Product Detail

 
料號 | BSM600D12P3G001
狀態 | 推薦品
封裝 | G
單位數量 | 4
最小包裝數量 | 4
包裝形式 | Corrugated Cardboard
RoHS | Yes

規格:

Drain-source Voltage[V]

1200

Drain Current[A]

576.0

Total Power Dissipation[W]

2450

Junction Temperature(Max.)[°C]

175

Storage Temperature (Min.)[°C]

-40

Storage Temperature (Max.)[°C]

125

Package

Half bridge

Package Size [mm]

152x62 (t=18)

功能:

  • Low surge, low switching loss.
  • High-speed switching possible.
  • Reduced temperature dependance.

Evaluation
Board

 
    • Drive Board
    • AgileSwitch 2ASC-12A1HP / EDCA1

    • For BSM series (1200V, E / G type)
      Core Driver : 2ASC-12A1HP
      Adapter Board : EDCA1

  • Detail
    • Drive Board
    • BSMGD3G12D24-EVK001

    • This evaluation board, BSMGD3G12D24-EVK001, is a gate driver board for full SiC Modules with the 3nd Generation SiC-MOSFET in G and E type housing. This evaluation board contains all the necessary components for optimal and safety driving the SiC module.

  • User's Guide Purchase Inquiry
    • Snubber Module
    • MGSM1D72J2-145MH16

    • BSM series (1200V, E / G type)

  • Purchase Inquiry
    • Drive Board
    • TAMURA 2DU series

    • For BSM series (1200V, C / E / G type)

  • Detail
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Design Resources

 

Tools

Models

  • BSM600D12P3G001 PLECS Model
  • BSM600D12P3G001 SPICE Simulation Evaluation Circuit
  • BSM600D12P3G001 SPICE Model
  • BSM600D12P3G001 Thermal Model (lib)
  • How to Create Symbols for PSpice Models
  • Power Module Loss Simulator - 3Phase Inverter
  • Power Module Loss Simulator - Boost Converter
  • Power Module Loss Simulator - Buck Converter