SCT3105KL
N-channel SiC 功率MOSFET

溝槽閘極構造的SiC-MOSFET。平面型SiC-MOSFET相比,同一芯片尺寸的導通電阻可降低50%,這將大幅降低太陽能發電用功率調節器和工業設備用電源、工業用逆變器等所有相關設備的功率損耗。

Data Sheet 購買 *
* 本產品是標準級的產品。
本產品不建議使用的車載設備。

Product Detail

 
料號 | SCT3105KLGC11
狀態 | 推薦品
封裝 | TO-247N
單位數量 | 450
最小包裝數量 | 30
包裝形式 | Tube
RoHS | Yes

規格:

Drain-source Voltage[V]

1200

Drain-source On-state Resistance(Typ.)[mΩ]

105.0

Drain Current[A]

24.0

Total Power Dissipation[W]

134

Junction Temperature(Max.)[°C]

175

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

175

Package Size [mm]

16.0x21.0(t=5.0)

功能:

・ Low on-resistance
・ Fast switching speed
・ Fast reverse recovery
・ Easy to parallel
・ Simple to drive
・ Pb-free lead plating ; RoHS compliant

Design Resources

 

Documents

White Paper

  • Cutting-Edge Web Simulation Tool “ROHM Solution Simulator” Capable of Complete Circuit Verification of Power Devices and Driver ICs
  • LEADRIVE: Design, Test and System Evaluation of Silicon Carbide Power Modules and Motor Control Units
  • Solving the challenges of driving SiC MOSFETs with new packaging developments

Technical Articles

Schematic Design & Verification

  • [NEW]Application Note for SiC Power Devices and Modules
  • Calculating Power Loss from Measured Waveforms
  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Precautions during gate-source voltage measurement for SiC MOSFET
  • Snubber circuit design methods for SiC MOSFET
  • Gate-source voltage behaviour in a bridge configuration
  • Gate-Source Voltage Surge Suppression Methods
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Thermocouples
  • What is a Thermal Model? (SiC Power Device)
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • How to Use Thermal Models
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Tools

Simulations (Login Required)

「ROHM Solution Simulator」是一款能在ROHM官網上運行的電子電路模擬工具。從零件選擇和元件單體驗證等研發初期階段到系統級的驗證階段,各項模擬工作都可以在Web上執行。ROHM提供的SiC元件等功率元件產品、驅動IC和電源IC等IC產品,都可以在接近實際環境的解決方案電路中輕易地進行驗證,大幅縮短研發週期。
  • AC-DC PFC A001: BCM VIN=200V IIN=2.5A
  • AC-DC PFC A002: BCM Diode-Bridge-Less VIN=200V IIN=2.5A
  • AC-DC PFC A004: CCM VIN=200V IIN=2.5A
  • AC-DC PFC A005: CCM 2-Phase VIN=200V IIN=5A
  • AC-DC PFC A006: CCM Synchro VIN=200V IIN=2.5A
  • AC-DC PFC A011: DCM VIN=200V IIN=2.5A
  • AC-DC PFC A012: DCM 2-Phase VIN=200V IIN=5A
  • AC-DC PFC A014: DCM Synchro VIN=200V IIN=2.5A
  • DC-DC Converter C006: Buck Converter Vo=250V Io=20A
  • DC-DC Converter C007: Buck Converter 2-Phase Vo=250V Io=40A
  • DC-DC Converter C010: Flyback Converter VIN=800V Vo=25V Io=10A
  • DC-DC Converter C011: Forward Converter VIN=500V Vo=25V Io=10A
  • DC-DC Converter C012: LLC Buck Converter Vo=12V Io=250A
  • DC-DC Converter C013: Phase-Shift Buck Converter Vo=12V Io=250A
  • DC-DC Converter C014: Quasi-Resonant Converter VIN=800V Vo=25 Io=10A

Models

  • SCT3105KL SPICE Simulation Evaluation Circuit
  • SCT3105KL SPICE Model
  • SCT3105KL Thermal Model (lib)
  • How to Create Symbols for PSpice Models

Packaging & Quality

Package Information

  • Package Dimensions
  • Taping Information
  • Moisture Sensitivity Level
  • Anti-Whisker formation

Environmental Data

  • About Flammability of Materials
  • Compliance of the ELV directive
  • Report of SVHC under REACH Regulation

Export Information

  • About Export Administration Regulations (EAR)