BD63621MUV (新產品)
36V Stepper Motor Driver

BD63621MUV is a bipolar low-consumption driver that driven by PWM current. Rated power supply voltage of the device is 36V, and rated output current is 2.0A. CLK-IN driving mode is adopted for input interface, and excitation mode is corresponding to FULL STEP mode, HALF STEP mode (2 kinds), QUARTER STEP mode via a built-in DAC. In terms of current decay, the FAST DECAY/SLOW DECAY ratio may be set without any limitation, and all available modes may be controlled in the most appropriate way. In addition, the power supply may be driven by one single system, which simplifies the design.

Data Sheet 購買 *
* 本產品是標準級的產品。
本產品不建議使用的車載設備。

Product Detail

 
料號 | BD63621MUV-ZE2
狀態 | 推薦品
封裝 | VQFN028V5050
單位數量 | 2500
最小包裝數量 | 2500
包裝形式 | Taping
RoHS | Yes

規格:

Grade

Standard

Vcc (Max.)[V]

36.0

Power Supply Voltage (Max.) [V]

28.0

Power Supply Voltage (Min.) [V]

8.0

Iout (Max.)[A]

2.0

Iout Peak (Max.)[A]

2.5

Output On Resistance (Typ.)[Ω]

0.49

Interface

CLK-IN

Step

to 1 / 4

MIX DECAY Function

Yes

Single power supply input

Yes

Automotive class

No

Operating Temperature (Min.)[°C]

-25

Operating Temperature (Max.)[°C]

85

功能:

  • Rated output current(DC)2.0A
  • Low ON resistance DMOS output
  • CLK-IN drive mode
  • PWM constant current (other oscillation)
  • Built-in spike noise cancel function (external noise filter is unnecessary)
  • Full -, half (2 kinds)-, quarter step functionality
  • Freely timing excitation mode switch
  • Current decay mode switch
    (linearly variable FAST/SLOW DECAY ratio)
  • Normal rotation & reverse rotation switching function
  • Power save function
  • Built-in logic input pull-down resistor
  • Power-on reset function
  • Thermal shutdown circuit (TSD)
  • Over-current protection circuit (OCP)
  • Under voltage lock out circuit (UVLO)
  • Over voltage lock out circuit (OVLO)
  • Ghost Supply Prevention
    (protects against malfunction when power supply is disconnected)
  • Adjacent pins short protection
  • Microminiature, ultra-thin and high heat-radiation
    (exposed metal type) package

Design Resources

 

Technical Articles

Schematic Design & Verification

  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Notes for Temperature Measurement Using Thermocouples
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • Thermal Resistance
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Tools

2D/3D/CAD

  • VQFN028V5050 Footprint / Symbol
  • VQFN028V5050 3D STEP Data

Packaging & Quality

Manufacturing Data

  • Factory Information