BD16950EFV-C
2ch 半橋閘極驅動器

BD16950EFV是符合AEC-Q100的2ch半橋閘極驅動器。可透過從外部MCU執行16位元串列外設介面(SPI)進行控制。可獨立控制高側/低側Nch-MOSFET,可透過MCU以各種模式進行控制。而且,用於調整轉換速率的可變驅動電流設定適用於EMI和高效率驅動。錯誤信號可透過MCU讀取。還可透過MCU復位各種設定寄存器。

Product Detail

 
料號 | BD16950EFV-CE2
狀態 | 推薦品
封裝 | HTSSOP-B24
單位數量 | 2000
最小包裝數量 | 2000
包裝形式 | Taping
RoHS | Yes
Functional Safety | FS supportive

規格:

Grade

Automotive

Common Standard

AEC-Q100 (Automotive Grade)

Vcc (Max.)[V]

40.0

Power Supply Voltage (Max.)[V]

40.0

Power Supply Voltage (Min.)[V]

5.5

Output On Resistance (Typ.)[Ω]

10.0

Number of Motors

1.0

VREF・PWM

-

Current Limit

-

High Speed Drive

-

Automotive class

Yes

Operating Temperature (Min.)[°C]

-40

Operating Temperature (Max.)[°C]

125

功能:

  • AEC-Q100 Qualified
  • 2ch Half-Bridge Gate Drivers
  • 4 external MOSFETs are Controlled Independently
  • Half-Bridge Control Modes are Selected by SPI
  • Slew Rates are Controlled with Constant Source/Sink Current.
  • 500 kHz Oscillation for Charge Pump.
  • 16bit SPI

Evaluation
Board

 
    • Evaluation Board
    • BD16950EFV-EVK-001
    • This Evaluation Board consists of the Automotive 2-channel Half-Bridge Driver IC and USB cable. Also a GUI can be provided for easy SPI register configuration. Besides this motor driver IC the evaluation board contains all external components necessary for operation including a full bridge created by discrete FETs, an LDO for logic supply, SPI interface and various test points for signal monitoring.

  • User's Guide Purchase Inquiry

Design Resources

 

Documents

User's Guide

  • Evaluation Board User's Guide for BD16950EFV-C

Application Note

  • 2 Channel Half-Bridge Gate Driver Setup Guide

Technical Articles

Schematic Design & Verification

  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Thermocouples
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • Thermal Resistance
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Tools

Simulations (Login Required)

  • Method for Exporting Circuit Data (ROHM Solution Simulator)

2D/3D/CAD

  • HTSSOP-B24 Footprint / Symbol
  • HTSSOP-B24 3D STEP Data

Packaging & Quality

Manufacturing Data

  • Factory Information

Environmental Data

  • REACH SVHC Non-use Declaration