Models
- RD3L08BGN SPICE Model
Characteristics Data
- RD3L08BGN ESD Data
RD3L08BGN
RD3L08BGN
Nch 60V 80A 功率MOSFET
RD3L08BGN是具有低ON電阻的MOSFET，適用於開關應用。
Product Detail
規格:
Grade
Standard
Package Code
TO-252 (DPAK)
JEITA Package
SC-63
Package Size[mm]
6.6x10.0 (t=2.3)
Number of terminal
3
Polarity
Nch
Drain-Source Voltage VDSS[V]
60
Drain Current ID[A]
80.0
RDS(on)[Ω] VGS=4.5V(Typ.)
0.0057
RDS(on)[Ω] VGS=10V(Typ.)
0.0042
RDS(on)[Ω] VGS=Drive (Typ.)
0.0057
Total gate charge Qg[nC]
38.0
Power Dissipation (PD)[W]
119.0
Drive Voltage[V]
4.5
Mounting Style
Surface mount
Storage Temperature (Min.)[°C]
-55
Storage Temperature (Max.)[°C]
150
功能:
- Low on - resistance
- High power small mold package (TO-252)
- Pb-free lead plating ; RoHS compliant
- Halogen free
- 100% Rg and UIS tested
Design Resources
Technical Articles
Schematic Design & Verification
- Temperature derating method for Safe Operating Area (SOA)
- Calculation of Power Dissipation in Switching Circuit
- Method for Monitoring Switching Waveform
- Importance of Probe Calibration When Measuring Power: Deskew
- Impedance Characteristics of Bypass Capacitor
Thermal Design
- Two-Resistor Model for Thermal Simulation
- Notes for Temperature Measurement Using Thermocouples
- What is a Thermal Model? (Transistor)
- Notes for Temperature Measurement Using Forward Voltage of PN Junction
- Measurement Method and Usage of Thermal Resistance RthJC
- Precautions When Measuring the Rear of the Package with a Thermocouple
Tools
Models
- RD3L08BGN SPICE Model
Characteristics Data
- RD3L08BGN ESD Data
Packaging & Quality
Package Information
- Package Dimensions
- Explanation for Marking
- Condition of Soldering
- Moisture Sensitivity Level
- Anti-Whisker formation
Environmental Data
- About Flammability of Materials
- About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
- Compliance of the RoHS / ELV directive
Export Information
- About Export Regulations