QS5U17
2.5V Drive Nch+SBD MOSFET

場效電晶體MOSFET。將採用高階製程技術的低導通電阻MOSFET與蕭特基二極體(SBD)做結合,豐富的產品線以回應各市場需求。

Data Sheet 購買 *
* 本產品是標準級的產品。
本產品不建議使用的車載設備。

Product Detail

 
料號 | QS5U17TR
狀態 | 推薦品
封裝 | TSMT5
單位數量 | 3000
最小包裝數量 | 3000
包裝形式 | Taping
RoHS | Yes

規格:

Grade

Standard

Package Code

SOT-25T

Package Size [mm]

2.9x2.8 (t=1)

Number of terminal

5

Polarity

Nch+Schottky

Drain-Source Voltage VDSS[V]

30

Drain Current ID[A]

2.0

RDS(on)[Ω] VGS=2.5V(Typ.)

0.11

RDS(on)[Ω] VGS=4V(Typ.)

0.076

RDS(on)[Ω] VGS=4.5V(Typ.)

0.071

RDS(on)[Ω] VGS=Drive (Typ.)

0.11

Total gate charge Qg[nC]

2.8

Power Dissipation (PD)[W]

0.9

Drive Voltage[V]

2.5

Reverse voltage VR (Diode) [V]

20.0

Forward Current IF (Diode) [A]

1.0

Forward Current Surge Peak IFSM (Diode) [A]

3.0

Mounting Style

Surface mount

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

功能:

・以2.9×2.8mm的安裝面積實現了高功率、省空間的MOSFET

Design Resources

 

Technical Articles

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Basics of Thermal Resistance and Heat Dissipation
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Notes for Temperature Measurement Using Thermocouples
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • What is a Thermal Model? (Transistor)
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Tools

Models

  • QS5U17 SPICE Model
  • QS5U17 Thermal Model (lib)
  • How to Create Symbols for PSpice Models

Characteristics Data

  • ESD Data

Packaging & Quality

Package Information

  • Package Dimensions
  • Inner Structure
  • Taping Information
  • Explanation for Marking
  • Condition of Soldering
  • Moisture Sensitivity Level
  • Anti-Whisker formation

Manufacturing Data

  • Reliability Test Result

Environmental Data

  • Constitution Materials List - Please contact us by filling in the form.
  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations