BU9897GUL-W
WL-CSP EEPROM

ROHM的高信賴性EEPROM系列又增加了WL-CSP封裝類型。備有I2C BUS,SPI BUS介面，可對應 各種應用。特別最適合於無線、照相機等小型模組。

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* 本產品是標準級的產品。
本產品不建議使用的車載設備。
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Product Detail

 
料號 | BU9897GUL-WE2
狀態 | 可購買
封裝 | VCSP50L2
單位數量 | 3000
最小包裝數量 | 3000
包裝形式 | Taping
RoHS | Yes

規格:

Series

WL-CSP

Grade

Standard

I/F

I2C BUS(2-Wire)

Density [bit]

128k

Bit Format [Word x Bit]

16k x 8

Package

VCSP50L2

Package Size [mm]

2.44x1.99 (t=0.55)

Operating Temperature (Min.)[°C]

-40

Operating Temperature (Max.)[°C]

85

Vcc(Min.)[V]

1.7

Vcc(Max.)[V]

5.5

Circuit Current (Max.)[mA]

2.5

Standby Current (Max.)[μA]

2.0

Write Cycle (Max.)[ms]

5.0

Input Frequency (Max.)[Hz]

400k

Endurance (Max.)[Cycle]

106

Data Retention (Max.)[Year]

40

功能:

・採用WL-CSP封裝(VCSP50L2 : 2.44 × 1.99 × 0.55 mm
・完全符合I²C BUS規格
・寬廣的工作電壓: 1.7 to 5.5V
・可改寫高達1,000,000次
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Technical Articles

Schematic Design & Verification

  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Basics of Thermal Resistance and Heat Dissipation
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Thermal Resistance

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  • REACH SVHC Non-use Declaration
  • RoHS Comission Delegated Directive

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