BR25S128FVT-W
SPI BUS 128kbit(16384x8bit) EEPROM

世界頂級水準的ROHM的序列EEPROM在全球具有高度的市佔率,並備有豐富的容量、介面與封裝可供選擇。ROHM的序列EEPROM備有世界標準的BUS形式(Microwire、I²C、SPI),以及寬廣的工作電壓範圍(1.7 ~ 5.5V,1.8 ~ 5.5V,2.5 ~ 5.5V、3.0 ~ 3.6V),最適合電池裝置使用。全系列均採無鉛製,並符合RoHS指令。

Data Sheet 購買 *
* 本產品是標準級的產品。
本產品不建議使用的車載設備。

Product Detail

 
料號 | BR25S128FVT-WE2
狀態 | 可購買
封裝 | TSSOP-B8
單位數量 | 3000
最小包裝數量 | 3000
包裝形式 | Taping
RoHS | Yes

規格:

Series

BR25S-W

Grade

Standard

I/F

SPI BUS

Density [bit]

128k

Bit Format [Word x Bit]

16k x 8

Package

TSSOP-B8

Package Size [mm]

3x6.4(t=1.2)

Operating Temperature (Min.)[°C]

-40

Operating Temperature (Max.)[°C]

85

Vcc(Min.)[V]

1.7

Vcc(Max.)[V]

5.5

Circuit Current (Max.)[mA]

2.0

Standby Current (Max.)[μA]

2.0

Write Cycle (Max.)[ms]

5.0

Input Frequency (Max.)[Hz]

20M

Endurance (Max.)[Cycle]

106

Data Retention (Max.)[Year]

40

功能:

・完全符合全球標準SPI BUS規格
・寬廣的工作電壓範圍: 1.7 to 5.5V
・可改寫高達1,000,000次

Design Resources

 

Technical Articles

Schematic Design & Verification

  • Opcode, Address, and Page Configuration for SPI BUS EEPROM
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Thermal Resistance

Tools

2D/3D/CAD

  • TSSOP-B8 Footprint / Symbol

Packaging & Quality

Package Information

  • Package Information
  • Anti-Whisker formation

Manufacturing Data

  • Factory Information

Environmental Data

  • UL94 Flame Classifications of Mold Compound
  • Compliance with the ELV directive
  • REACH SVHC Non-use Declaration
  • RoHS Comission Delegated Directive

Export Information

  • The Export Control Order
  • Export Administration Regulations(EAR)