BR25H010F-2LB(H2)
125℃運作 SPI BUS 1kbit (128x8bit) EEPROM

本產品專為工具機市場設計、並保證可長期供貨之Rank 製品。是最適合至今各類應用使用的產品。
BR25H010-2C為SPI BUS介面方式的序列EEPROM。

Product Detail

 
料號 | BR25H010F-2LBH2
狀態 | 推薦品
封裝 | SOP8
單位數量 | 250
最小包裝數量 | 250
包裝形式 | Taping
RoHS | Yes

規格:

Series

BR25H-2LB

Grade

Industrial

I/F

SPI BUS

Density [bit]

1k

Bit Format [Word x Bit]

128 x 8

Package

SOP8

Operating Temperature (Min.)[°C]

-40

Operating Temperature (Max.)[°C]

125

Vcc(Min.)[V]

2.5

Vcc(Max.)[V]

5.5

Circuit Current (Max.)[mA]

3.0

Standby Current (Max.)[μA]

10.0

Write Cycle (Max.)[ms]

4.0

Input Frequency (Max.)[Hz]

10M

Endurance (Max.)[Cycle]

106

Data Retention (Max.)[Year]

40

功能:

· Long time support a product for Industrial applications.
· High speed clock action up to 10MHz (Max.)
· Wait function by HOLDB terminal.
· Part or whole of memory arrays settable as read only
memory area by program.
· 2.5V to 5.5V single power source action most
suitable
for battery use.
· Page write mode useful for initial value write at
factory shipment.
· For SPI bus interface (CPOL, CPHA)=(0, 0), (1, 1)
· Self-timed programming cycle.
· Low Supply Current
At write operation (5V) : 1.0mA (Typ.)
At read operation (5V) : 1.0mA (Typ.)
At standby operation (5V) : 0.1µA (Typ.)
· Address auto increment function at read operation
· Prevention of write mistake
Write prohibition at power on.
Write prohibition by command code (WRDI).
Write prohibition by WPB pin.
Write prohibition block setting by status registers
(BP1, BP0).
Prevention of write mistake at low voltage.
· Data at shipment Memory array: FFh, status register
BP1, BP0 : 0
· More than 100 years data retention.
· More than 1 million write cycles.

Design Resources

 

Technical Articles

Schematic Design & Verification

  • Opcode, Address, and Page Configuration for SPI BUS EEPROM
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • Thermal Resistance

Tools

2D/3D/CAD

  • SOP8 Footprint / Symbol
  • SOP8 3D STEP Data

Packaging & Quality

Package Information

  • Package Information
  • Anti-Whisker formation

Manufacturing Data

  • Factory Information

Environmental Data

  • UL94 Flame Classifications of Mold Compound
  • Compliance with the ELV directive
  • REACH SVHC Non-use Declaration
  • RoHS Comission Delegated Directive

Export Information

  • The Export Control Order
  • Export Administration Regulations(EAR)