BR25G1MF-3
SPI BUS EEPROM

BR25G1MF-3是1Mbit SPI BUS介面的序列EEPROM。

Data Sheet 購買 *
* 本產品是標準級的產品。
本產品不建議使用的車載設備。

Product Detail

 
料號 | BR25G1MF-3GE2
狀態 | 推薦品
封裝 | SOP8
單位數量 | 2500
最小包裝數量 | 2500
包裝形式 | Taping
RoHS | Yes

規格:

Series

BR25G-3

Grade

Standard

I/F

SPI BUS

Density [bit]

1024k

Bit Format [Word x Bit]

128k x 8

Package

SOP8

Operating Temperature (Min.)[°C]

-40

Operating Temperature (Max.)[°C]

85

Vcc(Min.)[V]

1.8

Vcc(Max.)[V]

5.5

Circuit Current (Max.)[mA]

3.0

Standby Current (Max.)[μA]

10.0

Write Cycle (Max.)[ms]

5.0

Input Frequency (Max.)[Hz]

10M

Endurance (Max.)[Cycle]

106

Data Retention (Max.)[Year]

100

功能:

  • High Speed Clock Action up to 10MHz (Max)
  • Wait Function by HOLDB Terminal
  • Part or Whole of Memory Arrays Settable as Read only Memory Area by Program
  • 1.8V to 5.5V Single Power Source Operation Most Suitable for Battery Use.
  • Up to 256 Bytes in Page Write Mode.
  • For SPI Bus Interface (CPOL, CPHA) = (0, 0), (1, 1)
  • Self-timed Programming Cycle
  • Low Current Consumption
  • Address Auto Increment Function at Read Action
  • Prevention of Write Mistake
  • More than 100 years Data Retention.
  • More than 1 Million Write Cycles.
  • Bit Format 128K×8

Design Resources

 

Technical Articles

Schematic Design & Verification

  • Opcode, Address, and Page Configuration for SPI BUS EEPROM
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • Thermal Resistance

Tools

2D/3D/CAD

  • SOP8 Footprint / Symbol
  • SOP8 3D STEP Data

Packaging & Quality

Package Information

  • Package Information
  • Anti-Whisker formation

Manufacturing Data

  • Factory Information

Environmental Data

  • UL94 Flame Classifications of Mold Compound
  • Compliance with the ELV directive
  • REACH SVHC Non-use Declaration
  • RoHS Comission Delegated Directive

Export Information

  • The Export Control Order
  • Export Administration Regulations(EAR)