BR93G86NUX-3B
Microwire BUS 16kbit(1024x16bit) EEPROM

BR93G86-3B為序列3線式介面方式的序列EEPROM。
資料 bit形式為16bit固定、採用3PIN作為CS PIN的PIN配置。

Data Sheet 購買 *
* 本產品是標準級的產品。
本產品不建議使用的車載設備。

Product Detail

 
料號 | BR93G86NUX-3BTTR
狀態 | 推薦品
封裝 | VSON008X2030
單位數量 | 4000
最小包裝數量 | 4000
包裝形式 | Taping
RoHS | Yes

規格:

Series

BR93G-3B

Grade

Standard

I/F

MicroWire BUS(3-Wire)

Density [bit]

16k

Bit Format [Word x Bit]

1k x 16

Package

VSON008X2030

Operating Temperature (Min.)[°C]

-40

Operating Temperature (Max.)[°C]

85

Vcc(Min.)[V]

1.7

Vcc(Max.)[V]

5.5

Circuit Current (Max.)[mA]

3.0

Standby Current (Max.)[μA]

2.0

Write Cycle (Max.)[ms]

5.0

Input Frequency (Max.)[Hz]

3M

Endurance (Max.)[Cycle]

106

Data Retention (Max.)[Year]

40

Comment

Pin rotated type. Cu wire bonding.

功能:

・ 3-line communications of chip select, serial clock, serial data input / output (the case where input and output are shared)
・ Operations available at high speed 3MHz clock (4.5V ~ 5.5V)
・ High speed write available (write time 5ms max.)
・ Same package and pin configuration from 1Kbit to 16Kbit
・ 1.7~5.5V single power source operation
・ Address auto increment function at read operation
・ Write mistake prevention function » Write prohibition at power on » Write prohibition by command code » Write mistake prevention function at low voltage
・ Self-timed programming cycle
・ Program condition display by READY / BUSY
・ Compact package SOP8/SOP-J8/SSOP-B8/TSSOP-B8/MSOP8/ TSSOP-B8J/DIP-T8/VSON008X2030
・ More than 40 years data retention
・ More than 1 million write cycles
・ Initial delivery state all addresses FFFFh

Design Resources

 

Technical Articles

Schematic Design & Verification

  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • Thermal Resistance

Tools

Simulations (Login Required)

  • Method for Exporting Circuit Data (ROHM Solution Simulator)

2D/3D/CAD

  • VSON008X2030 Footprint / Symbol

Packaging & Quality

Package Information

  • Anti-Whisker formation

Manufacturing Data

  • Factory Information

Environmental Data

  • UL94 Flame Classifications of Mold Compound
  • Compliance with the ELV directive
  • REACH SVHC Non-use Declaration
  • RoHS Comission Delegated Directive

Export Information

  • The Export Control Order
  • Export Administration Regulations(EAR)