BR93G46FVT-3A
Microwire BUS 1kbit(64x16bit) EEPROM

BR93G46-3A為序列3線式介面方式的序列EEPROM。
資料 bit形式為16bit固定、採用1PIN作為CS PIN的標準PIN配置。

Data Sheet 購買 *
* 本產品是標準級的產品。
本產品不建議使用的車載設備。

Product Detail

 
料號 | BR93G46FVT-3AGE2
狀態 | 推薦品
封裝 | TSSOP-B8
單位數量 | 3000
最小包裝數量 | 3000
包裝形式 | Taping
RoHS | Yes

規格:

Series

BR93G-3A

Grade

Standard

I/F

MicroWire BUS(3-Wire)

Density [bit]

1k

Bit Format [Word x Bit]

64 x 16

Package

TSSOP-B8

Package Size [mm]

3x6.4 (t=1.2)

Operating Temperature (Min.)[°C]

-40

Operating Temperature (Max.)[°C]

85

Vcc(Min.)[V]

1.7

Vcc(Max.)[V]

5.5

Circuit Current (Max.)[mA]

3.0

Standby Current (Max.)[μA]

2.0

Write Cycle (Max.)[ms]

5.0

Input Frequency (Max.)[Hz]

3M

Endurance (Max.)[Cycle]

106

Data Retention (Max.)[Year]

40

Comment

Pin rotated type. Cu wire bonding.

功能:

・ 3-line communications of chip select, serial clock, serial data input / output (the case where input and output are shared)
・ Operations available at high speed 3MHz clock (4.5 V~5.5 V)
・ High speed write available (write time 5ms max.)
・ Same package and pin configuration from 1Kbit to 16Kbit
・ 1.7~5.5V single power source operation
・ Address auto increment function at read operation
・ Write mistake prevention function » Write prohibition at power on » Write prohibition by command code » Write mistake prevention function at low voltage
・ Self-timed programming cycle
・ Program condition display by READY / BUSY
・ Compact package SOP8/SOP-J8/SSOP-B8/TSSOP-B8/MSOP8/ TSSOP-B8J/DIP-T8/VSON008X2030
・ More than 40 years data retention
・ More than 1 million write cycles
・ Initial delivery state all addresses FFFFh

Design Resources

 

Documents

Application Note

  • Difference between BR93G-3A/3B and BR93LR-W/L-W

Technical Articles

Schematic Design & Verification

  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Basics of Thermal Resistance and Heat Dissipation
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Thermal Resistance

Tools

Models

  • BR93G46FVT-3A IBIS Model

2D/3D/CAD

  • TSSOP-B8 Footprint / Symbol

Packaging & Quality

Package Information

  • Package Information
  • Anti-Whisker formation

Manufacturing Data

  • Factory Information

Environmental Data

  • UL94 Flame Classifications of Mold Compound
  • Compliance with the ELV directive
  • REACH SVHC Non-use Declaration
  • RoHS Comission Delegated Directive

Export Information

  • The Export Control Order
  • Export Administration Regulations(EAR)