BR25H160FVM-2C
車用125℃工作SPI BUS 16kbit (2048x8bit) EEPROM

BR25H160-2C是SPI BUS介面方式的序列EEPROM。

Product Detail

 
料號 | BR25H160FVM-2CTR
狀態 | 推薦品
封裝 | MSOP8
單位數量 | 3000
最小包裝數量 | 3000
包裝形式 | Taping
RoHS | Yes
Functional Safety | FS supportive

規格:

Series

BR25H-2C

Grade

Automotive

I/F

SPI BUS

Density [bit]

16k

Bit Format [Word x Bit]

2k x 8

Package

MSOP8

Operating Temperature (Min.)[°C]

-40

Operating Temperature (Max.)[°C]

125

Vcc(Min.)[V]

2.5

Vcc(Max.)[V]

5.5

Circuit Current (Max.)[mA]

3.0

Standby Current (Max.)[μA]

10.0

Write Cycle (Max.)[ms]

4.0

Input Frequency (Max.)[Hz]

10M

Endurance (Max.)[Cycle]

106

Data Retention (Max.)[Year]

100

功能:

・High speed clock action up to 10MHz (Max.)
・Wait function by HOLDB terminal.
・Part or whole of memory arrays settable as read only
memory area by program.
・2.5V to 5.5V single power source action most
suitable
for battery use.
・Page write mode useful for initial value write at
factory shipment.
・For SPI bus interface (CPOL, CPHA)=(0, 0), (1, 1)
・Self-timed programming cycle.
・Low Supply Current
At write operation (5V) : 1.0mA (Typ.)
At read operation (5V) : 1.0mA (Typ.)
At standby operation (5V) : 0.1μA (Typ.)
・Address auto increment function at read operation
・Prevention of write mistake
Write prohibition at power on.
Write prohibition by command code (WRDI).
Write prohibition by WPB pin.
Write prohibition block setting by status registers
(BP1, BP0).
Prevention of write mistake at low voltage.
・MSOP8, TSSOP-B8, SOP8, SOP-J8 Package
・Data at shipment Memory array: FFh, status register
WPEN, BP1, BP0 : 0
・More than 100 years data retention.
・More than 1 million write cycles.
・AEC-Q100 Qualified.

Design Resources

 

Documents

Application Note

  • Difference between BR25H-2C, BR25H-W(C) and BR35H-WC

Technical Articles

Schematic Design & Verification

  • Opcode, Address, and Page Configuration for SPI BUS EEPROM
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • Thermal Resistance

Tools

2D/3D/CAD

  • MSOP8 Footprint / Symbol

Packaging & Quality

Package Information

  • Package Information
  • Anti-Whisker formation

Manufacturing Data

  • Factory Information

Environmental Data

  • UL94 Flame Classifications of Mold Compound
  • Compliance with the ELV directive
  • REACH SVHC Non-use Declaration
  • RoHS Comission Delegated Directive

Export Information

  • The Export Control Order
  • Export Administration Regulations(EAR)