RGT50NS65D(LPDS)
短路耐量 5µs, 650V 25A, 內建快速回復二極體, LPDS, 場截止溝槽型IGBT

ROHM的IGBT(絕緣閘極型雙極電晶體)產品為廣大的高電壓、大電流應用的高效化和節能化做出了貢獻。

Data Sheet 購買 *
* 本產品是標準級的產品。
本產品不建議使用的車載設備。

Product Detail

 
料號 | RGT50NS65DGTL
狀態 | 推薦品
封裝 | LPDS
單位數量 | 1000
最小包裝數量 | 1000
包裝形式 | Taping
RoHS | Yes

規格:

Series

T: For inverter (tsc 5µs)

VCES [V]

650

IC(100°C)[A]

25

VCE(sat) (Typ.) [V]

1.65

tf(Typ.) [ns]

65

tsc(Min.) [us]

5

Built-in Diode

FRD

Pd [W]

194

BVCES (Min.)[V]

650

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

175

功能:

  • Low Collector-Emitter Saturation Voltage
  • Low Switching Loss
  • Short Circuit Withstand Time 5µs
  • Built in Very Fast & Soft Recovery FRD (RFN-Series)
  • Pb-free Lead Plating; RoHS Compliant

Design Resources

 

Documents

Application Note

  • How to Create Symbols for PSpice Models

Technical Articles

Schematic Design & Verification

  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • Notes for Temperature Measurement Using Thermocouples
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • What is a Thermal Model? (IGBT)
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Tools

Models

  • RGT50NS65D(LPDS) SPICE Model
  • RGT50NS65D(LPDS) Thermal Model (lib)

Packaging & Quality

Package Information

  • Package Dimensions
  • Taping Information
  • Explanation for Marking
  • Moisture Sensitivity Level
  • Anti-Whisker formation

Manufacturing Data

  • Reliability Test Result

Environmental Data

  • About Flammability of Materials
  • Compliance of the ELV directive
  • Report of SVHC under REACH Regulation

Export Information

  • About Export Administration Regulations (EAR)