RB706F-40FH
Schottky Barrier Diodes (支持 AEC-Q101)

車用蕭特基二極體
DataSheet與通用品共用。訂購的時候請注意以下登錄的型號,請以車用料號下訂。

Product Detail

 
料號 | RB706F-40FHT106
狀態 | 可購買
封裝 | UMD3
單位數量 | 3000
最小包裝數量 | 3000
包裝形式 | Taping
RoHS | Yes

規格:

Grade

Automotive

Common Standard

AEC-Q101 (Automotive Grade)

Configuration

Series Connection

Package Code

SOT-323

Package(JEITA)

SC-70

Package Size[mm]

2.0x2.1 (t=0.9)

Mounting Style

Surface mount

Number of terminal

3

VRM[V]

45

Reverse Voltage VR[V]

40

Average Rectified Forward Current IO[A]

0.03

IFSM[A]

0.2

Forward Voltage VF(Max.)[V]

0.37

IF @ Forward Voltage [A]

0.001

Reverse Current IR(Max.)[mA]

0.001

VR @ Reverse Current[V]

10

Storage Temperature (Min.)[°C]

-40

Storage Temperature (Max.)[°C]

125

功能:

・小型化Mold Type。
・低VF、高可靠性。

Design Resources

 

Documents

Application Note

  • How to Create Symbols for PSpice Models

Technical Articles

Schematic Design & Verification

  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • Notes for Temperature Measurement Using Thermocouples
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • What is a Thermal Model? (Diode)
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Tools

Models

  • RB706F-40FH SPICE Model
  • RB706F-40FH Thermal Model (lib)

2D/3D/CAD

  • UMD3 STEP Data

Packaging & Quality

Package Information

  • Package Dimensions
  • Taping Information
  • Explanation for Marking
  • Moisture Sensitivity Level
  • Anti-Whisker formation
  • Condition of Soldering

Environmental Data

  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations