RB218NS200 - 技術資料

RB218NS200是利用其超低IR特性,實現了高達200V的耐壓、用於開關電源的蕭特基二極體。與一般FRD產品相比,VF特性可降低約11%,有助於應用的低功耗化。

關於RBxx8系列
在高溫環境下使用的車電和電源設備的電路,希望將以往的整流二極體和FRD替換為效率性能更優異的SBD。然而另一方面,SBD存在的問題是隨著工作環境溫度上升,IR特性會惡化,容易引發熱失控。RBxx8系列採用非常適用於高溫環境的阻擋金屬,大大改善了IR特性,成功打造了在車電和工業設備等高溫環境下也可安全使用、無需擔心熱失控的SBD系列產品。

* 本產品是標準級的產品。本產品不建議使用的車載設備。

Application Note

Part Explanation
 
For Diodes
Notes for Temperature Measurement Using Thermocouples
 
This application note explains cautions regarding the temperature measurement. The content of this application note is generally applicable, irrespective of the types of semiconductor devices.
Two-Resistor Model for Thermal Simulation
 
This application note explains the two-resistor model, which is the simplest model among thermal models used in thermal simulations. The thermal simulations mentioned three-dimensional model thermal conduction and thermal fluid analysis tools.
What is a Thermal Model? (Diode)
 
Thermal models are models for performing simulations in relation to heat among SPICE models. Simulations using the thermal models are performed to make a rough estimate during the initial stage of thermal design. This application note explains the thermal models.
Notes for Temperature Measurement Using Forward Voltage of PN Junction
 
This application note explains cautions regarding the temperature measurement Using Forward Voltage of PN Junction. The content of this application note is generally applicable, irrespective of the types of semiconductor devices.
Method for Monitoring Switching Waveform
 
This application note explains how to correctly monitor the switching waveforms of the power device element such as switching power supply or a motor drive circuit.
Measurement Method and Usage of Thermal Resistance RthJC
 
This application note describes how to measure and use the junction-to-case thermal resistance of a discrete semiconductor device.
Impedance Characteristics of Bypass Capacitor
 
This application note focuses on the impedance characteristics of capacitors, and explains cautions for selecting bypass capacitors.
Precautions When Measuring the Rear of the Package with a Thermocouple
 
This application note describes precautions when measuring the temperature on the rear of a package using a thermocouple to find the junction temperature of a semiconductor chip during actual operation.