DAP236U
Band Switching Diodes

Data Sheet 購買 *
* 本產品是標準級的產品。
本產品不建議使用的車載設備。

Product Detail

 
料號 | DAP236UT106
狀態 | 可購買
封裝 | UMD3
單位數量 | 3000
最小包裝數量 | 3000
包裝形式 | Taping
RoHS | Yes

規格:

Grade

Standard

Configuration

A-Common

Package Code

SOT-323

Package(JEITA)

SC-70

Package Size[mm]

2.0x2.1 (t=0.9)

Mounting Style

Surface mount

Number of terminal

3

Reverse Voltage VR[V]

35

Tj[°C]

125

Ct[pF]

1.2

VR @ Ct [V]

6

f @ Ct [MHz]

1

rF[Ω]

0.9

IF @ rF [mA]

2

f @ rF [MHz]

100

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

125

功能:

・超小型化Mold Type(UMD3)。
・高可靠性。

Design Resources

 

Technical Articles

Schematic Design & Verification

  • Method for Monitoring Switching Waveform
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • Notes for Temperature Measurement Using Thermocouples
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • What is a Thermal Model? (Diode)
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Tools

Models

  • DAP236U SPICE Model
  • DAP236U Thermal Model (lib)

2D/3D/CAD

  • UMD3 STEP Data

Characteristics Data

  • ESD Data

Packaging & Quality

Package Information

  • Package Dimensions
  • Inner Structure
  • Taping Information
  • Explanation for Marking
  • Moisture Sensitivity Level
  • Anti-Whisker formation
  • Condition of Soldering

Manufacturing Data

  • Reliability Test Result

Environmental Data

  • Constitution Materials List
  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations