Models
- DAP236U SPICE Model
- DAP236U Thermal Model (lib)
- How to Create Symbols for PSpice Models
2D/3D/CAD
- UMD3 STEP Data
DAP236U
Product Detail
規格:
Grade
Standard
Configuration
A-Common
Package Code
SOT-323
Package Size [mm]
2x2.1 (t=1)
Package(JEITA)
SC-70
Mounting Style
Surface mount
Number of terminal
3
Reverse Voltage VR[V]
35
Tj[°C]
125
Ct[pF]
1.2
VR @ Ct [V]
6
f @ Ct [MHz]
1
rF[Ω]
0.9
IF @ rF [mA]
2
f @ rF [MHz]
100
Storage Temperature (Min.)[°C]
-55
Storage Temperature (Max.)[°C]
125
功能:
・超小型化Mold Type(UMD3)。・高可靠性。
Design Resources
Documents
Data Sheet
Technical Articles
Schematic Design & Verification
Thermal Design
- What Is Thermal Design
- Basics of Thermal Resistance and Heat Dissipation
- Method for Calculating Junction Temperature from Transient Thermal Resistance Data
- Notes for Temperature Measurement Using Thermocouples
- Two-Resistor Model for Thermal Simulation
- Notes for Temperature Measurement Using Forward Voltage of PN Junction
- What is a Thermal Model? (Diode)
- Measurement Method and Usage of Thermal Resistance RthJC
- Precautions When Measuring the Rear of the Package with a Thermocouple
Tools
Models
- DAP236U SPICE Model
- DAP236U Thermal Model (lib)
- How to Create Symbols for PSpice Models
2D/3D/CAD
- UMD3 STEP Data