Models
- DAP236U SPICE Model
- DAP236U Thermal Model (lib)
2D/3D/CAD
- UMD3 STEP Data
Characteristics Data
- ESD Data
DAP236U
Product Detail
規格:
Grade
Standard
Configuration
A-Common
Package Code
SOT-323
Package(JEITA)
SC-70
Package Size[mm]
2.0x2.1 (t=0.9)
Mounting Style
Surface mount
Number of terminal
3
Reverse Voltage VR[V]
35
Tj[°C]
125
Ct[pF]
1.2
VR @ Ct [V]
6
f @ Ct [MHz]
1
rF[Ω]
0.9
IF @ rF [mA]
2
f @ rF [MHz]
100
Storage Temperature (Min.)[°C]
-55
Storage Temperature (Max.)[°C]
125
功能:
・超小型化Mold Type(UMD3)。・高可靠性。
Design Resources
Technical Articles
Schematic Design & Verification
- Method for Monitoring Switching Waveform
- Importance of Probe Calibration When Measuring Power: Deskew
- Impedance Characteristics of Bypass Capacitor
Thermal Design
- Notes for Temperature Measurement Using Thermocouples
- Two-Resistor Model for Thermal Simulation
- Notes for Temperature Measurement Using Forward Voltage of PN Junction
- What is a Thermal Model? (Diode)
- Measurement Method and Usage of Thermal Resistance RthJC
- Precautions When Measuring the Rear of the Package with a Thermocouple
Tools
Models
- DAP236U SPICE Model
- DAP236U Thermal Model (lib)
2D/3D/CAD
- UMD3 STEP Data
Characteristics Data
- ESD Data
Packaging & Quality
Package Information
- Package Dimensions
- Inner Structure
- Taping Information
- Explanation for Marking
- Moisture Sensitivity Level
- Anti-Whisker formation
- Condition of Soldering
Manufacturing Data
- Reliability Test Result
Environmental Data
- Constitution Materials List
- About Flammability of Materials
- About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
- Compliance of the RoHS / ELV directive
Export Information
- About Export Regulations