ROHM Product Detail

ML22Q666-NNNTB(Tray)
內建快閃記憶體類型

Lapis

ML226xx系列是一款整合4Mbit到32Mbit快閃記憶體的Speech Synthesis LSIs。
大容量記憶體非常適合長時間的音訊播放,例如語音引導。快閃記憶體可以輕鬆地重寫音訊資料,並具有從MCU重寫聲音資料的功能。
採用了實現高音質的HQ-ADPCM、16位元D/A轉換器和低通濾波器,並內建1.0W單聲道喇叭放大器,可以直接驅動喇叭。
由於音訊輸出所需的功能都整合在單一晶片中,因此只需添加此LSI即可輕鬆實現音訊功能。

Product Detail

 
料號 | ML22Q666-NNNTBZ0AX
狀態 | 推薦品
封裝 | P-TQFP32-0707-0.80-Z6K6-MC
包裝形式 | Tray
單位數量 | 2500
最小包裝數量 | 2500
RoHS | Yes

規格:

Operating Voltage [V]

2.7 to 3.6 or 3.3 to 5.5

Operating Frequency [MHz]

4.096
4.000

Oscillator

Built-in
External

Operating Temperature (Min.)[°C]

-40

Operating Temperature (Max.)[°C]

70

ROM Capacity [bit]

Flash
32M

Number of Phrases ?

4096

Maximum Playback Time ?

27min *1

CPU I/F

I2C

SP Amplifier Output [W] / Class

1.0/AB-class,
D-class

Number of Mixing (Internal) [ch]

4

Others

Failure detection

Automotive Grade

No

AEC-Q100 standard

No

Industrial Grade

Yes

Find Similar

Development Support

 
    • Reference Board
    • RB-S22Q66xTB32
    • Supply Status
      Recommended
      Supporuted LSI
      • ML22Q663
      • ML22Q664
      • ML22Q665
      • ML22Q666
      Composition
      • Reference board with TQFP32 socket
      • User's Manual
      Notes
      • Used by connecting to SDCB3.

  • User's Guide Buy
    • Reference Board
    • RB-S22Q66xGD32
    • Supply Status
      Recommended
      Supporuted LSI
      • ML22Q663
      • ML22Q664
      • ML22Q665
      • ML22Q666
      Composition
      • Reference board with WQFN32 socket
      • User's Manual
      Notes
      • Used by connecting to SDCB3.

  • User's Guide Purchase Inquiry
    • Development Kit
    • SDCK3
    • Supply Status
      Recommended
      Supporuted LSI
      • ML22530, Q532, Q533, Q535
      • ML22620, Q623, Q624, Q625, Q626
      • ML22660, Q663, Q664, Q665, Q666
      • ML22Q234, Q244, Q254
      • ML22Q274, Q284, Q294
      • ML22572, 573, Q573, Q553, ML22594
      • ML22Q374, Q394
      • ML22562, 563, Q563
      • ML22823, 824, 825
      • ML22863, 864, 865
      Composition
      • Sound device control board 3 [SDCB3]
      • USB cable

  • User's Guide Buy

"LAPIS TECHNOLOGY™" is a trademark or a registered trademark of ROHM Co., Ltd.

X

Most Viewed