Videos & Catalogs
影片一覽
二合一SiC模組DOT-247 - SCZ40xx 系列
2025-10-17 00:00:00.0
( 1.90 MB )
DOT-247是匯集二顆Discrete TO-247封裝於一體的二合一SiC封裝型模組。該產品有二種內部拓撲可選，有助次世代功率轉換電路等實現更高功率密度。該產品非常適用於PV Inverter、UPS、半導體繼電器等工業設備，另外車規級產品也在開發中。
DOT-247是匯集二顆Discrete TO-247封裝於一體的二合一SiC封裝型模組。該產品有二種內部拓撲可選，有助次世代功率轉換電路等實現更高功率密度。該產品非常適用於PV Inverter、UPS、半導體繼電器等工業設備，另外車規級產品也在開發中。
影片一覽
內建SiC MOSFET小型封裝型模組（HSDIP20） - BSTxxx1P4K01, BSTxxx2P4K01
2025-04-24 00:00:00.0
( 1.37 MB )
BSTxxx1P4K01（750V）和BSTxxx2P4K01（1,200V）是內建4顆或6顆SiC MOSFET的封裝型模組。將大功率應用的電源轉換電路中所需的基本電路，集約到小型模組封裝中，助力應用產品小型化。
BSTxxx1P4K01（750V）和BSTxxx2P4K01（1,200V）是內建4顆或6顆SiC MOSFET的封裝型模組。將大功率應用的電源轉換電路中所需的基本電路，集約到小型模組封裝中，助力應用產品小型化。
影片一覽
X-in-1 HSDIP20 SiC Modules
2025-04-24 00:00:00.0
( 3:13 )
Integrating ROHM SiC MOSFETs, which combine low ON resistance with high-speed switching, into the HSDIP20 package, results in industry-leading current density that enables fast charging.
Integrating ROHM SiC MOSFETs, which combine low ON resistance with high-speed switching, into the HSDIP20 package, results in industry-leading current density that enables fast charging.
影片一覽
Molded Power Modules for Traction Inverter Drive TRCDRIVE pack™ - BSTxxxD12P4Axxx, BSTxxxxD08P4Axxx
2024-06-10 00:00:00.0
( 1.13 MB )
Power module with ultra-high current density and compact easy-to-mount single-sided high heat dissipation molded package.
Power module with ultra-high current density and compact easy-to-mount single-sided high heat dissipation molded package.
Parametric Search
Loading...
