N-channel SiC 功率MOSFET


Product Detail

料號 | SCT3060ALHRC11
狀態 | 推薦品
封裝 | TO-247N
單位數量 | 450
最小包裝數量 | 30
包裝形式 | Tube
RoHS | Yes


Common Standard

AEC-Q101 (Automotive Grade)

Drain-source Voltage[V]


Drain-source On-state Resistance(Typ.)[mΩ]


Drain Current[A]


Total Power Dissipation[W]


Junction Temperature(Max.)[°C]


Storage Temperature (Min.)[°C]


Storage Temperature (Max.)[°C]


Package Size [mm]

16x21 (t=5.2)


  • Low on-resistance
  • Fast switching speed
  • Fast reverse recovery
  • Easy to parallel
  • Simple to drive
  • Pb-free lead plating ; RoHS compliant
  • Qualified to AEC-Q101

Design Resources



White Paper

  • Cutting-Edge Web Simulation Tool “ROHM Solution Simulator” Capable of Complete Circuit Verification of Power Devices and Driver ICs
  • LEADRIVE: Design, Test and System Evaluation of Silicon Carbide Power Modules and Motor Control Units
  • Solving the challenges of driving SiC MOSFETs with new packaging developments

Technical Articles

Schematic Design & Verification

  • [NEW]Application Note for SiC Power Devices and Modules
  • Calculating Power Loss from Measured Waveforms
  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Precautions during gate-source voltage measurement for SiC MOSFET
  • Snubber circuit design methods for SiC MOSFET
  • Gate-Source Voltage Surge Suppression Methods
  • Gate-source voltage behaviour in a bridge configuration
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Basics of Thermal Resistance and Heat Dissipation
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Thermocouples
  • What is a Thermal Model? (SiC Power Device)
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • How to Use Thermal Models
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple


Simulations (Login Required)

「ROHM Solution Simulator」是一款能在ROHM官網上運行的電子電路模擬工具。從零件選擇和元件單體驗證等研發初期階段到系統級的驗證階段,各項模擬工作都可以在Web上執行。ROHM提供的SiC元件等功率元件產品、驅動IC和電源IC等IC產品,都可以在接近實際環境的解決方案電路中輕易地進行驗證,大幅縮短研發週期。
  • DC-DC Converter C016: LLC Full Bridge Vo=400V Io=15A


  • SCT3060ALHR SPICE Simulation Evaluation Circuit
  • SCT3060ALHR SPICE Model
  • SCT3060ALHR Thermal Model (lib)
  • How to Create Symbols for PSpice Models

Packaging & Quality

Package Information

  • Package Dimensions
  • Taping Information
  • Moisture Sensitivity Level
  • Anti-Whisker formation
  • Condition of Soldering

Environmental Data

  • About Flammability of Materials
  • Compliance of the ELV directive
  • Report of SVHC under REACH Regulation

Export Information

  • About Export Administration Regulations (EAR)