Models
- RN739F SPICE Model
- RN739F Thermal Model (lib)
- How to Create Symbols for PSpice Models
2D/3D/CAD
- UMD3 STEP Data
Characteristics Data
- ESD Data
RN739F
RN739F
PIN Diodes
ROHM的PIN二極體有針對行動電話、無線網路的Switching Type和針對Tuner的Attenuator Type兩種類型。
Product Detail
規格:
Grade
Standard
Configuration
Series Connection
Package Code
SOT-323
Package Size [mm]
2.0x2.1 (t=0.9)
Package(JEITA)
SC-70
Mounting Style
Surface mount
Number of terminal
3
Reverse Voltage VR[V]
50
IF[mA]
50.0
Tj[°C]
125
Ct[pF]
0.4
VR @ Ct [V]
35
f @ Ct [MHz]
1
rF[Ω]
7.0
IF @ rF [mA]
10
f @ rF [MHz]
100
Storage Temperature (Min.)[°C]
-55
Storage Temperature (Max.)[°C]
150
功能:
・小型化Mold Type(UMD3)。・高頻順向阻抗小且低電容量。
Design Resources
Technical Articles
Schematic Design & Verification
- Method for Monitoring Switching Waveform
- Importance of Probe Calibration When Measuring Power: Deskew
- Impedance Characteristics of Bypass Capacitor
Thermal Design
- What Is Thermal Design
- Method for Calculating Junction Temperature from Transient Thermal Resistance Data
- Notes for Temperature Measurement Using Thermocouples
- Two-Resistor Model for Thermal Simulation
- Notes for Temperature Measurement Using Forward Voltage of PN Junction
- What is a Thermal Model? (Diode)
- Measurement Method and Usage of Thermal Resistance RthJC
- Precautions When Measuring the Rear of the Package with a Thermocouple
Tools
Models
- RN739F SPICE Model
- RN739F Thermal Model (lib)
- How to Create Symbols for PSpice Models
2D/3D/CAD
- UMD3 STEP Data
Characteristics Data
- ESD Data
Packaging & Quality
Package Information
- Package Dimensions
- Inner Structure
- Taping Information
- Explanation for Marking
- Moisture Sensitivity Level
- Anti-Whisker formation
- Condition of Soldering
Manufacturing Data
- Reliability Test Result
Environmental Data
- Constitution Materials List
- About Flammability of Materials
- About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
- Compliance of the RoHS / ELV directive
Export Information
- About Export Regulations