ML22Q625-NNNTB(Tray)
內建快閃記憶體類型
ML22Q625-NNNTB(Tray)
內建快閃記憶體類型
ML226xx系列是語音合成LSI，內建4Mbit至32Mbit的快閃記憶體。
大容量記憶體非常適合長時間播放音訊，例如語音導覽。快閃記憶體可輕鬆重寫音訊資料，也具備從MCU重寫音訊資料的功能。
採用HQ-ADPCM、16位元D/A轉換器和低通濾波器，可實現高品質音效，並內建1.0W單聲道揚聲器放大器，可直接驅動揚聲器。
由於音訊輸出所需的功能都整合在單一晶片上，因此只需增加此LSI即可輕鬆實現音訊功能。
樣品可於ML22Q625-NNNTB (包裝類型：卷帶)中取得。
Product Detail
規格:
Operating Voltage [V]
2.7 to 3.6 or 3.3 to 5.5
Operating Frequency [MHz]
4.096
4.000
Oscillator
Built-in
External
Operating Temperature (Min.)[°C]
-40
Operating Temperature (Max.)[°C]
70
ROM Capacity [bit]
Flash
16M
Number of Phrases ?
4096
Maximum Playback Time ?
14min *1
CPU I/F
Clock synchronous serial
SP Amplifier Output [W] / Class
1.0/AB-class,
D-class
Number of Mixing (Internal) [ch]
4
Others
Rewrite Flash from MCU / Failure detection
Automotive Grade
No
AEC-Q100 standard
No
Industrial Grade
Yes
Development Support
-
- Reference Board
- RB-S22Q62xTB32
- Supply Status
- Recommended
- Supporuted LSI
- ML22Q623
- ML22Q624
- ML22Q625
- ML22Q626
- Composition
- Reference board with TQFP32 socket
- User's Manual
- Notes
- Used by connecting to SDCB3.
-
- Reference Board
- RB-S22Q62xGD32
- Supply Status
- Recommended
- Supporuted LSI
- ML22Q623
- ML22Q624
- ML22Q625
- ML22Q626
- Composition
- Reference board with WQFN32 socket
- User's Manual
- Notes
- Used by connecting to SDCB3.
-
- Development Kit
- SDCK3
- Supply Status
- Recommended
- Supporuted LSI
- ML22530, Q532, Q533, Q535
- ML22620, Q623, Q624, Q625, Q626
- ML22660, Q663, Q664, Q665, Q666
- ML22Q234, Q244, Q254
- ML22Q274, Q284, Q294
- ML22572, 573, Q573, Q553, ML22594
- ML22Q374, Q394
- ML22562, 563, Q563
- ML22823, 824, 825
- ML22863, 864, 865
- Composition
- Sound device control board 3 [SDCB3]
- USB cable
"LAPIS TECHNOLOGY™" is a trademark or a registered trademark of ROHM Co., Ltd.