BSM080D12P2C008
SiC(碳化矽)功率模組

本品是使用ROHM生產的SiC-DMOSFET和SiC蕭特基二極體的斬波結構的SiC MOSFET模組。

Data Sheet 購買 *
* 本產品是標準級的產品。
本產品不建議使用的車載設備。

Product Detail

 
料號 | BSM080D12P2C008
狀態 | 推薦品
封裝 | C
單位數量 | 12
最小包裝數量 | 12
包裝形式 | Corrugated Cardboard
RoHS | Yes

規格:

Drain-source Voltage[V]

1200

Drain Current[A]

80.0

Total Power Dissipation[W]

600

Junction Temperature(Max.)[°C]

175

Storage Temperature (Min.)[°C]

-40

Storage Temperature (Max.)[°C]

125

Package

Half bridge

功能:

  • Low surge, low switching loss.
  • High-speed switching possible.
  • Reduced temperature dependance.

Evaluation
Board

 
    • Drive Board
    • AgileSwitch 2ASC-12A1HP / EDCA2
    • BSM series (1200V, C type)
      Core Driver : 2ASC-12A1HP
      Adapter Board : EDCA2

  • Detail
    • Drive Board
    • BSMGD3C12D24-EVK001
    • This evaluation board, BSMGD3C12D24-EVK001, is a gate driver board for full SiC Modules in C type housing. This evaluation board contains all the necessary components for optimal and safety driving the SiC module.

  • User's Guide Purchase Inquiry
    • Drive Board
    • TAMURA 2DU series
    • For BSM series (1200V, C / E / G type)

  • Detail

Design Resources

 

Documents

White Paper

  • Cutting-Edge Web Simulation Tool “ROHM Solution Simulator” Capable of Complete Circuit Verification of Power Devices and Driver ICs

User's Guide

  • Evaluation Board User's Guide for C-type Full SiC Module (BSMGD3C12D24-EVK001)

Technical Articles

Schematic Design & Verification

  • Calculation of Power Dissipation in Switching Circuit
  • Method for Monitoring Switching Waveform
  • Application Note for SiC Power Devices and Modules
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • Notes for Temperature Measurement Using Thermocouples
  • What is a Thermal Model? (SiC Power Device)
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • How to Use Thermal Models
  • Optimized heat sink assembly method for effective heat dissipation
  • Measurement Method and Usage of Thermal Resistance RthJC
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Tools

Simulations (Login Required)

  • AC-DC PFC
    Circuit Number A003: BCM Diode-Bridge-Less VIN=200V IIN=50A
  • AC-DC PFC
    Circuit Number A008: CCM Diode-Bridge-Less Synchro VIN=200V IIN=50A
  • AC-DC PFC
    Circuit Number A010: CCM Totem-Pole Synchro VIN=200V IIN=100A
  • AC-DC PFC
    Circuit Number A017: DCM Diode-Bridge-Less Synchro VIN=200V IIN=50A
  • DC-AC Inverter
    Circuit Number B001: IH Half-Bridge Inverter Po=10kW
  • DC-AC Inverter
    Circuit Number B002: IH Full-Bridge Inverter Po=20kW
  • DC-AC Inverter
    Circuit Number B003: Half-Bridge Inverter Vo=200V Io=100A
  • DC-AC Inverter
    Circuit Number B004: Full-Bridge Inverter Vo=200V Io=100A
  • DC-AC Inverter
    Circuit Number B005: 1-Phase 3-Wire Inverter Vo=100/200V Po=20kW
  • DC-DC Converter
    Circuit Number C001: Bi-Directional Converter VH=350V VL=50V IL=200A
  • DC-DC Converter
    Circuit Number C002: Boost Converter Vo=800V Io=20A
  • DC-DC Converter
    Circuit Number C003: Boost Converter 2-Phase Vo=800V Io=40A
  • DC-DC Converter
    Circuit Number C004: Boost Synchro Converter Vo=800V Io=20A
  • DC-DC Converter
    Circuit Number C008: Buck Synchro Converter Vo=250V Io=100A
  • DC-DC Converter
    Circuit Number C009: Buck Synchro Converter 2-Phase Vo=250V Io=200A
  • DC-DC Converter
    Circuit Number C015: Step-Up/Down Converter Vo=400V Io=40A
  • ROHM Solution Simulator Power Device Use's Guide for PFC Circuits

Models

  • Circuit Data: Half-Bridge PS Inverter Po=10kW
  • Circuit Data: Half-Bridge PS Inverter Po=10kW (for Thermal evaluation)
  • BSM080D12P2C008 SPICE Simulation Evaluation Circuit
  • BSM080D12P2C008 SPICE Model
  • BSM080D12P2C008 Thermal Model (lib)
  • BSM080D12P2C008 PLECS Model
  • Power Module Loss Simulator - 3Phase Inverter
  • Power Module Loss Simulator - Boost Converter
  • Power Module Loss Simulator - Buck Converter

Characteristics Data

  • ESD Data

Packaging & Quality

Package Information

  • Inner Structure
  • Taping Information

Manufacturing Data

  • Reliability Test Result

Environmental Data

  • Constitution Materials List
  • Compliance of the ELV directive
  • Report of SVHC under REACH Regulation

Export Information

  • About Export Regulations