BD9S200MUF-C
車電用2.7V～5.5V 輸入 2A MOSFET內建 1ch同步整流 降壓 DC/DC轉換器

BD9S200MUF-C是內建低導通電阻的功率MOSFET的同步整流降壓型DC/DC轉換器。最大可輸出2A的電流。憑藉SLLM™控制，實現輕載狀態的良好效率特性，適用於降低設備的待機功耗。具有2.2MHz高速開關頻率，適用於小型電感。具有基於電流模式控制的高速瞬態回應性能，可輕鬆設定相位補償。還可與外部脈衝同步。

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Product Detail

 
料號 | BD9S200MUF-CE2
狀態 | 推薦品
封裝 | VQFN16FV3030 (Wettable Flank)
單位數量 | 3000
最小包裝數量 | 3000
包裝形式 | Taping
RoHS | Yes

功能安全:

類別 : FS supportive
A product that has been developed for automotive use and is capable of supporting safety analysis with regard to the functional safety.
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規格:

Grade

Automotive

Common Standard

AEC-Q100 (Automotive Grade)

ch

1

Integrated FET / Controller

Integrated FET

Topology

Buck

Synchronous / Nonsynchronous

Synchronous

Vin1(Min.)[V]

2.7

Vin1(Max.)[V]

5.5

Vout1(Min.)[V]

0.8

Vout1(Max.)[V]

4.4

Iout1(Max.)[A]

2.0

SW frequency(Max.)[MHz]

2.2

Light Load mode

Yes

EN

Yes

PGOOD

Yes

Operating Temperature (Min.)[°C]

-40

Operating Temperature (Max.)[°C]

125

功能:

  • SLLM™ (Simple Light Load Mode) Control
  • AEC-Q100 Qualified(Grade 1)
  • Single Synchronous Buck DC/DC Converter
  • Adjustable Soft Start Function
  • Power Good Output
  • Input Under Voltage Lockout Protection
  • Short Circuit Protection
  • Output Over Voltage Protection
  • Over Current Protection
  • Thermal Shutdown Protection
  • Wettable Flank QFN Package

Evaluation
Board

 
    • Evaluation Board
    • BD9S200MUF-TSB-001

    • This is an evaluation board for ROHM’s single Synchronous buck DC/DC converter BD9S200MUF-C. The BD9S200MUF-C accepts a power supply input range of 2.7V to 5.5V and generates a maximum output current of 2A. The SLLM™ control provides excellent efficiency characteristics in light-load conditions which make the product ideal for reducing standby power consumption of equipment.

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Design Resources

 

Documents

White Paper

  • Cutting-Edge Web Simulation Tool “ROHM Solution Simulator” Capable of Complete Circuit Verification of Power Devices and Driver ICs
  • For Automotive ADAS/Infotainment application, CISPR25 Class5 compliant 8 rails power tree Reference Design with power rail monitoring for supporting functional safety

User's Guide

  • Evaluation Board User's Guide for BD9S200MUF-C

Technical Articles

Schematic Design & Verification

  • Calculation of Power Dissipation in Switching Circuit
  • Considering Input Filter to Reduce Conducted Emissions by DCDC Converter
  • Considering Polarity of Power Inductor to Reduce Radiated Emission of DC-DC converter
  • Method for Monitoring Switching Waveform
  • Phase Compensation Design for Current Mode Buck Converter
  • Bootstrap Circuit in the Buck Converter
  • Method for Determining Constants of
  • Power Supply Sequence Circuit with General Purpose Power Supply IC
  • Suppression Method of Switching Noise Using Linear Regulator and Low Pass Filter
  • PCB Layout Techniques of Buck Converter
  • Measurement Method for Phase Margin with Frequency Response Analyzer (FRA)
  • Usage of SPICE Macromodel for DC/DC
  • Snubber Circuit for Buck Converter IC
  • Efficiency of Buck Converter
  • Calculation of Power Loss (Synchronous)
  • Inductor Calculation for Buck converter IC
  • Considerations for Power Inductors Used for Buck Converters
  • Capacitor Calculation for Buck converter IC
  • The Important Points of Multi-layer Ceramic Capacitor Used in Buck Converter circuit
  • Resistor Value Table to set Output Voltage of Buck Converter IC
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Thermocouples
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • Thermal Resistance
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Tools

Simulations (Login Required)

「ROHM Solution Simulator」是一款能在ROHM官網上運行的電子電路模擬工具。從零件選擇和元件單體驗證等研發初期階段到系統級的驗證階段，各項模擬工作都可以在Web上執行。ROHM提供的SiC元件等功率元件產品、驅動IC和電源IC等IC產品，都可以在接近實際環境的解決方案電路中輕易地進行驗證，大幅縮短研發週期。
  • BD9S200MUF / Frequency Domain

Models

  • Unencrypted SPICE Model (Inquiry Form)
  • BD9S200MUF-C SPICE Model

2D/3D/CAD

  • BD9S200MUF-C Footprint / Symbol
  • VQFN16FV3030 Footprint / Symbol
  • VQFN16FV3030 3D STEP Data

Packaging & Quality

Manufacturing Data

  • Factory Information

Environmental Data

  • REACH SVHC Non-use Declaration