BD8314NUV - 技術資料

2.5A/1.2MHz升壓切換式穩壓器BD8314NUV透過4顆電池、Li1sell、LI²Cell等電池、5V固定電源來產生8V、10V等之升壓輸出。此款IC透過1.2MHz的高頻動作以減小外接線圈/電容體積,另外還內建2.5A額定規格為80MΩ的Nch FET開關,並配備靈活性極高的相位補償內建系統,讓您輕鬆即可架構出輸出電流範圍寬廣的小型化產品。

* 本產品是標準級的產品。本產品不建議使用的車載設備。

White Paper

Cutting-Edge Web Simulation Tool “ROHM Solution Simulator” Capable of Complete Circuit Verification of Power Devices and Driver ICs
 
In recent years, the advancing digitization of applications is expanding the number and role of electronic circuits, resulting in a considerable amount of man-hours spent on circuit design, from component selection during application development to board design and evaluation. This document discribes the solution for solving customer issues for each design flow with ROHM's support and tools.

Application Note

Calculation of Power Dissipation in Switching Circuit
 
This application note describes how to calculate the power dissipation that occurs in a SiC MOSFET in a switching circuit with the SiC MOSFET during switching operations.
Considering Input Filter to Reduce Conducted Emissions by DCDC Converter
 
This application note is about designing input filter which is attributed to reduce level of conducted emissions to an acceptable value for DC-DC converter.
Notes for Temperature Measurement Using Thermocouples
 
This application note explains cautions regarding the temperature measurement. The content of this application note is generally applicable, irrespective of the types of semiconductor devices.
Two-Resistor Model for Thermal Simulation
 
This application note explains the two-resistor model, which is the simplest model among thermal models used in thermal simulations. The thermal simulations mentioned three-dimensional model thermal conduction and thermal fluid analysis tools.
Notes for Temperature Measurement Using Forward Voltage of PN Junction
 
This application note explains cautions regarding the temperature measurement Using Forward Voltage of PN Junction. The content of this application note is generally applicable, irrespective of the types of semiconductor devices.
Considering Polarity of Power Inductor to Reduce Radiated Emission of DC-DC converter
 
This application note is about radiated emission caused by a power inductor in a DC-DC converter dependent to the polarity of a coil.
Method for Monitoring Switching Waveform
 
This application note explains how to correctly monitor the switching waveforms of the power device element such as switching power supply or a motor drive circuit.
Suppression Method of Switching Noise Using Linear Regulator and Low Pass Filter
 
This application note describes the method and result of the ripple and switching noise suppression using a linear regulator and a low pass filter.
Power Supply Sequence Circuit with General Purpose Power Supply IC
 
This application note proposes a circuit that accomplishes the power supply sequence without using any dedicated power supply sequence IC, by using general purpose power supply ICs.
Phase Compensation Design for Current Mode Buck Converter
 
This application note explains the method used by ROHM for designing the phase compensation for current mode buck converters.
Measurement Method for Phase Margin with Frequency Response Analyzer (FRA)
 
This application note introduces a method for easily measuring the phase margin with a Frequency Response Analyzer (FRA) made by NF Corporation.
Usage of SPICE Macromodel for DC/DC
 
This application note explains how to install SPICE macromodels and how the circuit symbols are configured.
Calculation of Power Loss (Synchronous)
 
This application note describes how to obtain the power loss required to calculate the temperature of a semiconductor device. Temperature control is important to ensuring product reliability.
Importance of Probe Calibration When Measuring Power: Deskew
 
Even when devices used for measurement are calibrated regularly, they will give incorrect results if calibration is not perfo rmed for the measurement environment. This application note explains the importance of probe calibration in power measurement environments.
Thermal Resistance
 
The definition and how to use thermal resistance and thermal characterization parameter of packages for ROHM’s integrated circuit are described in this application note.
Impedance Characteristics of Bypass Capacitor
 
This application note focuses on the impedance characteristics of capacitors, and explains cautions for selecting bypass capacitors.
Precautions When Measuring the Rear of the Package with a Thermocouple
 
This application note describes precautions when measuring the temperature on the rear of a package using a thermocouple to find the junction temperature of a semiconductor chip during actual operation.
Package Ordering Unit
 
For ICs