BD8158FVM - 技術資料
BD8158FVM為低電壓FET內建型1ch升壓交換式穩壓器。輸入電壓為2.1V to 4.0V,因此能達到低耗電的目標。反饋電壓的精度高達1%,並能減少輸出電壓時所產生的偏差。
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White Paper
Cutting-Edge Web Simulation Tool “ROHM Solution Simulator” Capable of Complete Circuit Verification of Power Devices and Driver ICs
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In recent years, the advancing digitization of applications is expanding the number and role of electronic circuits, resulting in a considerable amount of man-hours spent on circuit design, from component selection during application development to board design and evaluation. This document discribes the solution for solving customer issues for each design flow with ROHM's support and tools.
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Application Note
Calculation of Power Dissipation in Switching Circuit
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This application note describes how to calculate the power dissipation that occurs in a SiC MOSFET in a switching circuit with the SiC MOSFET during switching operations.
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Considering Input Filter to Reduce Conducted Emissions by DCDC Converter
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This application note is about designing input filter which is attributed to reduce level of conducted emissions to an acceptable value for DC-DC converter.
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Notes for Temperature Measurement Using Thermocouples
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This application note explains cautions regarding the temperature measurement. The content of this application note is generally applicable, irrespective of the types of semiconductor devices.
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Two-Resistor Model for Thermal Simulation
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This application note explains the two-resistor model, which is the simplest model among thermal models used in thermal simulations. The thermal simulations mentioned three-dimensional model thermal conduction and thermal fluid analysis tools.
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Notes for Temperature Measurement Using Forward Voltage of PN Junction
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This application note explains cautions regarding the temperature measurement Using Forward Voltage of PN Junction. The content of this application note is generally applicable, irrespective of the types of semiconductor devices.
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Considering Polarity of Power Inductor to Reduce Radiated Emission of DC-DC converter
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This application note is about radiated emission caused by a power inductor in a DC-DC converter dependent to the polarity of a coil.
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Method for Monitoring Switching Waveform
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This application note explains how to correctly monitor the switching waveforms of the power device element such as switching power supply or a motor drive circuit.
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Power Supply Sequence Circuit with General Purpose Power Supply IC
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This application note proposes a circuit that accomplishes the power supply sequence without using any dedicated power supply sequence IC, by using general purpose power supply ICs.
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Phase Compensation Design for Current Mode Buck Converter
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This application note explains the method used by ROHM for designing the phase compensation for current mode buck converters.
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Suppression Method of Switching Noise Using Linear Regulator and Low Pass Filter
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This application note describes the method and result of the ripple and switching noise suppression using a linear regulator and a low pass filter.
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Measurement Method for Phase Margin with Frequency Response Analyzer (FRA)
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This application note introduces a method for easily measuring the phase margin with a Frequency Response Analyzer (FRA) made by NF Corporation.
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Usage of SPICE Macromodel for DC/DC
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This application note explains how to install SPICE macromodels and how the circuit symbols are configured.
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Calculation of Power Loss (Synchronous)
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This application note describes how to obtain the power loss required to calculate the temperature of a semiconductor device. Temperature control is important to ensuring product reliability.
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Importance of Probe Calibration When Measuring Power: Deskew
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Even when devices used for measurement are calibrated regularly, they will give incorrect results if calibration is not perfo rmed for the measurement environment. This application note explains the importance of probe calibration in power measurement environments.
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Thermal Resistance
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The definition and how to use thermal resistance and thermal characterization parameter of packages for ROHM’s integrated circuit are described in this application note.
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Impedance Characteristics of Bypass Capacitor
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This application note focuses on the impedance characteristics of capacitors, and explains cautions for selecting bypass capacitors.
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Precautions When Measuring the Rear of the Package with a Thermocouple
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This application note describes precautions when measuring the temperature on the rear of a package using a thermocouple to find the junction temperature of a semiconductor chip during actual operation.
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Part Explanation
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For ICs
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