BD8158FVM
1.5-5.5V 1ch Boost converter

BD8158FVM為低電壓FET內建型1ch升壓交換式穩壓器。輸入電壓為2.1V to 4.0V,因此能達到低耗電的目標。反饋電壓的精度高達1%,並能減少輸出電壓時所產生的偏差。

Data Sheet 購買 *
* 本產品是標準級的產品。
本產品不建議使用的車載設備。

Product Detail

 
料號 | BD8158FVM-TR
狀態 | 推薦品
封裝 | MSOP8
單位數量 | 3000
最小包裝數量 | 3000
包裝形式 | Taping
RoHS | Yes

規格:

Grade

Standard

ch

1

Integrated FET / Controller

Integrated FET

Topology

Boost

Synchronous / Nonsynchronous

Non-synchronous

Vin1(Min.)[V]

2.1

Vin1(Max.)[V]

5.5

Vout1(Min.)[V]

2.1

Vout1(Max.)[V]

14.0

Iout1(Max.)[A]

1.4

SW frequency(Max.)[MHz]

1.2

Light Load mode

No

EN

Yes

PGOOD

No

Operating Temperature (Min.)[°C]

-40

Operating Temperature (Max.)[°C]

125

功能:

・PWM系統電流模式
・輸入電壓範圍2.1V to 4.0V
・輸入頻率600kHz/1, 200kHz
・內建0.25Ω功率開關
・反饋電壓精密度1.245±1%
・內建UVLO電路
・內建過電流保護電路
・內建溫度保護電路

Design Resources

 

Documents

White Paper

  • Cutting-Edge Web Simulation Tool “ROHM Solution Simulator” Capable of Complete Circuit Verification of Power Devices and Driver ICs

Technical Articles

Schematic Design & Verification

  • Calculation of Power Dissipation in Switching Circuit
  • Considering Input Filter to Reduce Conducted Emissions by DCDC Converter
  • Considering Polarity of Power Inductor to Reduce Radiated Emission of DC-DC converter
  • Method for Monitoring Switching Waveform
  • Phase Compensation Design for Current Mode Buck Converter
  • Power Supply Sequence Circuit with General Purpose Power Supply IC
  • Suppression Method of Switching Noise Using Linear Regulator and Low Pass Filter
  • Measurement Method for Phase Margin with Frequency Response Analyzer (FRA)
  • Usage of SPICE Macromodel for DC/DC
  • Calculation of Power Loss (Synchronous)
  • Importance of Probe Calibration When Measuring Power: Deskew
  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • Two-Resistor Model for Thermal Simulation
  • Notes for Temperature Measurement Using Thermocouples
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • Thermal Resistance
  • Precautions When Measuring the Rear of the Package with a Thermocouple

Tools

Simulations (Login Required)

  • Method for Exporting Circuit Data (ROHM Solution Simulator)

2D/3D/CAD

  • MSOP8 Footprint / Symbol

Packaging & Quality

Package Information

  • Package Information
  • Anti-Whisker formation

Manufacturing Data

  • Factory Information

Environmental Data

  • UL94 Flame Classifications of Mold Compound
  • Compliance with the ELV directive
  • REACH SVHC Non-use Declaration
  • RoHS Comission Delegated Directive

Export Information

  • The Export Control Order
  • Export Administration Regulations(EAR)