Models
- RQ3C150BC SPICE Model
- RQ3C150BC Thermal Model (lib)
Characteristics Data
- ESD Data
RQ3C150BC
RQ3C150BC
Pch -20V -30A 中功率MOSFET
RQ3C150BC是針對開關和負載開關用途的中功率MOSFET。
Product Detail
規格:
Grade
Standard
Package Code
HSMT8 (3.3x3.3)
Package Size[mm]
3.3x3.3 (t=0.8)
Applications
Switching
Number of terminal
8
Polarity
Pch
Drain-Source Voltage VDSS[V]
-20
Drain Current ID[A]
-37.0
RDS(on)[Ω] VGS=1.8V(Typ.)
0.0088
RDS(on)[Ω] VGS=2.5V(Typ.)
0.0061
RDS(on)[Ω] VGS=4.5V(Typ.)
0.0048
RDS(on)[Ω] VGS=Drive (Typ.)
0.0088
Total gate charge Qg[nC]
60.0
Power Dissipation (PD)[W]
20.0
Drive Voltage[V]
1.8
Mounting Style
Surface mount
Storage Temperature (Min.)[°C]
-55
Storage Temperature (Max.)[°C]
150
功能:
- Low on - resistance.
- High Power Package (HSMT8).
- Pb-free lead plating; RoHS compliant.
- Halogen Free
Design Resources
Technical Articles
Schematic Design & Verification
- Temperature derating method for Safe Operating Area (SOA)
- Calculation of Power Dissipation in Switching Circuit
- Method for Monitoring Switching Waveform
- Importance of Probe Calibration When Measuring Power: Deskew
- Impedance Characteristics of Bypass Capacitor
Thermal Design
- Notes for Temperature Measurement Using Thermocouples
- Two-Resistor Model for Thermal Simulation
- Notes for Temperature Measurement Using Forward Voltage of PN Junction
- What is a Thermal Model? (Transistor)
- Measurement Method and Usage of Thermal Resistance RthJC
- Precautions When Measuring the Rear of the Package with a Thermocouple
Tools
Models
- RQ3C150BC SPICE Model
- RQ3C150BC Thermal Model (lib)
Characteristics Data
- ESD Data
Packaging & Quality
Package Information
- Package Dimensions
- Taping Information
- Explanation for Marking
- Condition of Soldering
- Moisture Sensitivity Level
- Anti-Whisker formation
Environmental Data
- About Flammability of Materials
- About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
- Compliance of the RoHS / ELV directive
Export Information
- About Export Regulations