R6007JNJ - 技術資料

R6007JNJ is a power MOSFET with fast reverse recovery time (trr), suitable for the switching applications.
PrestoMOS™ series, R60xxJNx series increases design flexibility while maintaining the industry’s fastest reverse recovery time (trr) optimized for EV charging stations and motor drive in home appliances such as refrigerators and Air Conditioners (ACs).

* 本產品是標準級的產品。本產品不建議使用的車載設備。

Application Note

Double-pulse test substantiated advantages of PrestoMOS™
 
Inverters and Totem pole type PFC (Power Factor Correction) include more than two transistors. In this circuits, short-circuit current penetrating through high and low arms deteriorates turn-on losses in some cases…
Part Explanation
 
For Transistors
Temperature derating method for Safe Operating Area (SOA)
 
This application note describes temperature derating method for SOA. Note that the basic method is the same for bipolar junction transistors (BJTs).
Calculation of Power Dissipation in Switching Circuit
 
This application note describes how to calculate the power dissipation that occurs in a SiC MOSFET in a switching circuit with the SiC MOSFET during switching operations.
Notes for Temperature Measurement Using Thermocouples
 
This application note explains cautions regarding the temperature measurement. The content of this application note is generally applicable, irrespective of the types of semiconductor devices.
Two-Resistor Model for Thermal Simulation
 
This application note explains the two-resistor model, which is the simplest model among thermal models used in thermal simulations. The thermal simulations mentioned three-dimensional model thermal conduction and thermal fluid analysis tools.
Notes for Temperature Measurement Using Forward Voltage of PN Junction
 
This application note explains cautions regarding the temperature measurement Using Forward Voltage of PN Junction. The content of this application note is generally applicable, irrespective of the types of semiconductor devices.
What is a Thermal Model? (Transistor)
 
Thermal models are models for performing simulations in relation to heat among SPICE models. Simulations using the thermal models are performed to make a rough estimate during the initial stage of thermal design. This application note explains the thermal models.
Method for Monitoring Switching Waveform
 
This application note explains how to correctly monitor the switching waveforms of the power device element such as switching power supply or a motor drive circuit.
Measurement Method and Usage of Thermal Resistance RthJC
 
This application note describes how to measure and use the junction-to-case thermal resistance of a discrete semiconductor device.
Impedance Characteristics of Bypass Capacitor
 
This application note focuses on the impedance characteristics of capacitors, and explains cautions for selecting bypass capacitors.
Precautions When Measuring the Rear of the Package with a Thermocouple
 
This application note describes precautions when measuring the temperature on the rear of a package using a thermocouple to find the junction temperature of a semiconductor chip during actual operation.