BR25S128GUZ-W
WL-CSP EEPROM

ROHM的高信賴性EEPROM系列又增加了WL-CSP封裝類型。備有I2C BUS,SPI BUS介面，可對應 各種應用。特別最適合於無線、照相機等小型模組。

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Product Detail

 
料號 | BR25S128GUZ-WE2
狀態 | 推薦品
封裝 | VCSP35L2
單位數量 | 3000
最小包裝數量 | 3000
包裝形式 | Taping
RoHS | Yes

規格:

Series

WL-CSP

Grade

Standard

I/F

SPI BUS

Density [bit]

128k

Bit Format [Word x Bit]

16k x 8

Package

VCSP35L2

Package Size [mm]

2x2.63(t=0.4)

Operating Temperature (Min.)[°C]

-40

Operating Temperature (Max.)[°C]

85

Vcc(Min.)[V]

1.7

Vcc(Max.)[V]

5.5

Circuit Current (Max.)[mA]

2.5

Standby Current (Max.)[μA]

2.0

Write Cycle (Max.)[ms]

5.0

Input Frequency (Max.)[Hz]

10M

Endurance (Max.)[Cycle]

106

Data Retention (Max.)[Year]

40

功能:

・採用WL-CSP封裝VCSP35L2 : 2.00 × 2.63 × 0.40 mm)
・完全符合SPI BUS規格
・工作電壓範圍寬: 1.7 to 5.5V
・数据可擦写1,000,000次
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Technical Articles

Schematic Design & Verification

  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Thermal Resistance

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  • Compliance with the ELV directive
  • REACH SVHC Non-use Declaration
  • RoHS Comission Delegated Directive

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