Simulations (Login Required)
- Method for Exporting Circuit Data (ROHM Solution Simulator)
Models
- KDZV3.9B SPICE Model
- KDZV3.9B Thermal Model (lib)
Characteristics Data
- ESD Data
KDZV3.9B
KDZV3.9B
齊納二極體
KDZV3.9B是適用於恆定電壓控制的小型功率模鑄型且高ESD耐量的二極體。
Product Detail
規格:
Grade
Standard
Configuration
Single
Package Code
SOD-123FL
Package(JEITA)
SC-109B
Package Size[mm]
3.5x1.6 (t=0.8)
Mounting Style
Surface mount
Number of terminal
2
Power Dissipation (PD)[mW]
1000
Zener Voltage VZ (Typ.)[V]
4.136
Zener Voltage VZ (Min.)[V]
3.9
Zener Voltage VZ (Max.)[V]
4.4
IZ @ VZ [mA]
40
Storage Temperature (Min.)[°C]
-55
Storage Temperature (Max.)[°C]
150
功能:
・小型化Power Mold Type。・高ESD耐壓。
Design Resources
Technical Articles
Schematic Design & Verification
- Method for Monitoring Switching Waveform
- Importance of Probe Calibration When Measuring Power: Deskew
- Impedance Characteristics of Bypass Capacitor
Thermal Design
- Notes for Temperature Measurement Using Thermocouples
- Two-Resistor Model for Thermal Simulation
- Notes for Temperature Measurement Using Forward Voltage of PN Junction
- What is a Thermal Model? (Diode)
- Measurement Method and Usage of Thermal Resistance RthJC
- Precautions When Measuring the Rear of the Package with a Thermocouple
Tools
Simulations (Login Required)
- Method for Exporting Circuit Data (ROHM Solution Simulator)
Models
- KDZV3.9B SPICE Model
- KDZV3.9B Thermal Model (lib)
Characteristics Data
- ESD Data
Packaging & Quality
Package Information
- Package Dimensions
- Inner Structure
- Taping Information
- Explanation for Marking
- Moisture Sensitivity Level
- Anti-Whisker formation
- Condition of Soldering
Manufacturing Data
- Reliability Test Result
Environmental Data
- Constitution Materials List
- About Flammability of Materials
- About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
- Compliance of the RoHS / ELV directive
Export Information
- About Export Regulations