KDZV3.9B
齊納二極體

Data Sheet

• KDZV3.9B Data Sheet

Application Note

• Advantages of PMDE Compact Package with High Heat Dissipation for Automotive Schottky Barrier Diodes

Schematic Design & Verification

• Low-Side Current Sensing Circuit Design
• Method for Monitoring Switching Waveform
• Importance of Probe Calibration When Measuring Power: Deskew
• Impedance Characteristics of Bypass Capacitor

Thermal Design

• Basics of Thermal Resistance and Heat Dissipation
• What Is Thermal Design
• Method for Calculating Junction Temperature from Transient Thermal Resistance Data
• Notes for Temperature Measurement Using Thermocouples
• Two-Resistor Model for Thermal Simulation
• Notes for Temperature Measurement Using Forward Voltage of PN Junction
• What is a Thermal Model? (Diode)
• Measurement Method and Usage of Thermal Resistance RthJC
• Precautions When Measuring the Rear of the Package with a Thermocouple

Models

• KDZV3.9B SPICE Model
• KDZV3.9B Thermal Model (lib)
• How to Create Symbols for PSpice Models

2D/3D/CAD

Characteristics Data

• ESD Data

Package Information

• Package Dimensions
• Inner Structure
• Taping Information
• Explanation for Marking
• Moisture Sensitivity Level
• Anti-Whisker formation
• Condition of Soldering

Manufacturing Data

• Reliability Test Result

Environmental Data

• List of Components
• About Flammability of Materials
• About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
• Compliance of the RoHS / ELV directive

Export Information

• About Export Regulations