Simulations (Login Required)
- Method for Exporting Circuit Data (ROHM Solution Simulator)
2D/3D/CAD
- SMD3 STEP Data
STZU6.2N
Product Detail
規格:
Package(JEITA)
SC-59
Package Code
SOT-346
Package Size
2.9x2.8 (t=1.1)
Mounting Style
Surface mount
Number of terminal
3
Grade
Standard
Power Dissipation (PD)[mW]
200
Configuration
A-Common
# of protection line
2
VRWM [V]
5.5
VBR (Min.) [V]
5.9
VBR (Max.) [V]
6.5
Capacitance [pF]
3.0
IR (Max.) [uA]
3.0
VESDIEC61000-4-2 [kV]
±8
Storage Temperature (Min.)[°C]
-55
Storage Temperature (Max.)[°C]
150
功能:
- High reliability
- Small mold type
- Low capacitance
Design Resources
Technical Articles
Schematic Design & Verification
- Method for Monitoring Switching Waveform
- Importance of Probe Calibration When Measuring Power: Deskew
- Impedance Characteristics of Bypass Capacitor
Thermal Design
- Notes for Temperature Measurement Using Thermocouples
- Two-Resistor Model for Thermal Simulation
- Notes for Temperature Measurement Using Forward Voltage of PN Junction
- What is a Thermal Model? (Diode)
- Measurement Method and Usage of Thermal Resistance RthJC
- Precautions When Measuring the Rear of the Package with a Thermocouple
Tools
Simulations (Login Required)
- Method for Exporting Circuit Data (ROHM Solution Simulator)
2D/3D/CAD
- SMD3 STEP Data
Packaging & Quality
Package Information
- Package Dimensions
- Taping Information
- Explanation for Marking
- Moisture Sensitivity Level
- Anti-Whisker formation
- Condition of Soldering
Environmental Data
- About Flammability of Materials
- About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
- Compliance of the RoHS / ELV directive
Export Information
- About Export Regulations