Models
- DAN222WM SPICE Model
- DAN222WM Thermal Model (lib)
2D/3D/CAD
- EMD3F STEP Data
Characteristics Data
- ESD Data
DAN222WM
DAN222WM
Switching Diodes
ROHM的切換式二極體一直以高產能、高信賴封裝自豪。多樣化的Diode Array產品線滿足各市場需求。
Product Detail
規格:
Grade
Standard
Configuration
C-Common
Package Code
SOT-416FL
Package(JEITA)
SC-89
Package Size[mm]
1.6x1.6 (t=0.7)
Mounting Style
Surface mount
Number of terminal
3
VRM[V]
80
Reverse Voltage VR[V]
80
Average Rectified Forward Current IO[A]
0.1
IFM[A]
0.3
Isurge[mA]
4000
Forward Voltage VF[V]
1.2
IF @ Forward Voltage [mA]
100.0
Reverse Current IR[µA]
0.1
VR @ Reverse Current [V]
70
trr[ns]
4
IF @ trr [mA]
5
VR @ trr [V]
6.0
Storage Temperature (Min.)[°C]
-55
Storage Temperature (Max.)[°C]
150
功能:
・小型化Mold Type。(平電極類型)・高速SW。
Design Resources
Technical Articles
Schematic Design & Verification
- Method for Monitoring Switching Waveform
- Importance of Probe Calibration When Measuring Power: Deskew
- Impedance Characteristics of Bypass Capacitor
Thermal Design
- Notes for Temperature Measurement Using Thermocouples
- Two-Resistor Model for Thermal Simulation
- Notes for Temperature Measurement Using Forward Voltage of PN Junction
- What is a Thermal Model? (Diode)
- Measurement Method and Usage of Thermal Resistance RthJC
- Precautions When Measuring the Rear of the Package with a Thermocouple
Tools
Models
- DAN222WM SPICE Model
- DAN222WM Thermal Model (lib)
2D/3D/CAD
- EMD3F STEP Data
Characteristics Data
- ESD Data
Packaging & Quality
Package Information
- Package Dimensions
- Inner Structure
- Taping Information
- Explanation for Marking
- Moisture Sensitivity Level
- Anti-Whisker formation
- Condition of Soldering
Manufacturing Data
- Reliability Test Result
Environmental Data
- Constitution Materials List
- About Flammability of Materials
- About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
- Compliance of the RoHS / ELV directive
Export Information
- About Export Regulations