RB532HS-30
RASMID™系列, 30V, 0.2A, 蕭特基二極體
RB532HS-30
RASMID™系列, 30V, 0.2A, 蕭特基二極體
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Description
RB532HS-30是超小型封裝(0603尺寸)的蕭特基二極體。
Product Detail
Specifications
Configuration
Single
Package Code
SOD-962 (DSN0603-2)
Mounting Style
Surface mount
Number of terminal
2
VRM[V]
30
Reverse Voltage VR[V]
30
Average Rectified Forward Current IO[A]
0.2
Forward Voltage VF(Max.)[V]
0.3
IF @ Forward Voltage [A]
0.01
Reverse Current IR(Max.)[mA]
0.015
VR @ Reverse Current[V]
10
Tj[℃]
150
Storage Temperature (Min.)[°C]
-40
Storage Temperature (Max.)[°C]
150
Package Size [mm]
0.6x0.3 (t=0.29)
Features
- Small silicon package (SMD0603B)
- High Accuracy Manufacturing
- Dimension tolerance ±10um
- Low VF
Reference Design / Evaluation Tool
-

- Reference Design - REF68022
- Ultra-compact, ultra-thin NFC wireless power supply (100 mW)
The ML7671RD3-EVK-001 is equipped with the ML7671 LSI on the transmitter side, while the ML7670RD3-EVK-001 incorporates the ML7670 LSI on the receiver side. By aligning the antennas, the system can charge a battery with a power transfer of 100 mW. This reference design enables wireless power transfer using an ultra‑compact, ultra‑thin PCB. Because it is built on an FPC substrate, it can also be integrated into curved enclosures such as smart rings.