Models
- RBQ30NS45AFH SPICE Model
- RBQ30NS45AFH Thermal Model (lib)
Characteristics Data
- ESD Data
RBQ30NS45AFH
RBQ30NS45AFH
45V, 30A, High Efficiency , High Reliability Type Schottky Barrier Diodes (支持 AEC-Q101)
車用蕭特基二極體
DataSheet與通用品共用。訂購的時候請注意以下登錄的型號，請以車用料號下訂。
Product Detail
規格:
Grade
Automotive
Common Standard
AEC-Q101 (Automotive Grade)
Configuration
C-Common
Package Code
TO-263S (D2PAK)
Package(JEITA)
SC-83
Package Size[mm]
13.3x10.1 (t=4.5)
Mounting Style
Surface mount
Number of terminal
3
VRM[V]
45
Reverse Voltage VR[V]
45
Average Rectified Forward Current IO[A]
30.0
IFSM[A]
100.0
Forward Voltage VF(Max.)[V]
0.65
IF @ Forward Voltage [A]
15.0
Reverse Current IR(Max.)[mA]
0.2
VR @ Reverse Current[V]
45
Storage Temperature (Min.)[°C]
-55
Storage Temperature (Max.)[°C]
150
功能:
・共陰極型。・低IR、可靠性高。
Design Resources
Technical Articles
Schematic Design & Verification
- Method for Monitoring Switching Waveform
- Importance of Probe Calibration When Measuring Power: Deskew
- Impedance Characteristics of Bypass Capacitor
Thermal Design
- Notes for Temperature Measurement Using Thermocouples
- Two-Resistor Model for Thermal Simulation
- Notes for Temperature Measurement Using Forward Voltage of PN Junction
- What is a Thermal Model? (Diode)
- Measurement Method and Usage of Thermal Resistance RthJC
- Precautions When Measuring the Rear of the Package with a Thermocouple
Tools
Models
- RBQ30NS45AFH SPICE Model
- RBQ30NS45AFH Thermal Model (lib)
Characteristics Data
- ESD Data
Packaging & Quality
Package Information
- Package Dimensions
- Inner Structure
- Taping Information
- Explanation for Marking
- Moisture Sensitivity Level
- Anti-Whisker formation
- Condition of Soldering
Manufacturing Data
- Reliability Test Result
Environmental Data
- Constitution Materials List
- About Flammability of Materials
- About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
- Compliance of the RoHS / ELV directive
Export Information
- About Export Regulations