RRE02VTM4SFH
Product Detail
規格:
Grade
Automotive
Common Standard
AEC-Q101 (Automotive Grade)
Configuration
Single
Package Code
SOD-323HE
Package Size [mm]
1.4x2.5 (t=0.8)
Mounting Style
Surface mount
Number of terminal
2
VRM[V]
400
Average Rectified Forward Current IO[A]
0.2
IFSM[A]
1.0
Forward Voltage VF(Max.)[V]
1.1
IF @ Forward Voltage [A]
0.2
Reverse Current IR(Max.)[mA]
0.001
VR @ Reverse Current [V]
400
Storage Temperature (Min.)[°C]
-55
Storage Temperature (Max.)[°C]
150
功能:
- Small mold type (TUMD2SM)
- Low VF type.
Design Resources
Documents
Data Sheet
Technical Articles
Schematic Design & Verification
Thermal Design
- What Is Thermal Design
- Basics of Thermal Resistance and Heat Dissipation
- Method for Calculating Junction Temperature from Transient Thermal Resistance Data
- Notes for Temperature Measurement Using Thermocouples
- Two-Resistor Model for Thermal Simulation
- Notes for Temperature Measurement Using Forward Voltage of PN Junction
- What is a Thermal Model? (Diode)
- Measurement Method and Usage of Thermal Resistance RthJC
- Precautions When Measuring the Rear of the Package with a Thermocouple