Models
- RRE02VTM4SFH Thermal Model (lib)
2D/3D/CAD
- TUMD2SM STEP Data
Characteristics Data
- ESD Data
RRE02VTM4SFH
Product Detail
規格:
Grade
Automotive
Common Standard
AEC-Q101 (Automotive Grade)
Configuration
Single
Package Code
SOD-323HE
Package Size [mm]
1.4x2.5 (t=0.8)
Mounting Style
Surface mount
Number of terminal
2
VRM[V]
400
Average Rectified Forward Current IO[A]
0.2
IFSM[A]
1.0
Forward Voltage VF(Max.)[V]
1.1
IF @ Forward Voltage [A]
0.2
Reverse Current IR(Max.)[mA]
0.001
VR @ Reverse Current [V]
400
Storage Temperature (Min.)[°C]
-55
Storage Temperature (Max.)[°C]
150
功能:
- Small mold type (TUMD2SM)
- Low VF type.
Design Resources
Technical Articles
Schematic Design & Verification
- Method for Monitoring Switching Waveform
- Importance of Probe Calibration When Measuring Power: Deskew
- Impedance Characteristics of Bypass Capacitor
Thermal Design
- What Is Thermal Design
- Basics of Thermal Resistance and Heat Dissipation
- Method for Calculating Junction Temperature from Transient Thermal Resistance Data
- Notes for Temperature Measurement Using Thermocouples
- Two-Resistor Model for Thermal Simulation
- Notes for Temperature Measurement Using Forward Voltage of PN Junction
- What is a Thermal Model? (Diode)
- Measurement Method and Usage of Thermal Resistance RthJC
- Precautions When Measuring the Rear of the Package with a Thermocouple
Tools
Models
- RRE02VTM4SFH Thermal Model (lib)
2D/3D/CAD
- TUMD2SM STEP Data
Characteristics Data
- ESD Data
Packaging & Quality
Package Information
- Package Dimensions
- Inner Structure
- Taping Information
- Explanation for Marking
- Moisture Sensitivity Level
- Anti-Whisker formation
- Condition of Soldering
Manufacturing Data
- Reliability Test Result
Environmental Data
- Constitution Materials List
- About Flammability of Materials
- About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
- Compliance of the RoHS / ELV directive
Export Information
- About Export Regulations