ML22Q666-NNNTB(Taping)
內建快閃記憶體型
ML22Q666-NNNTB(Taping)
內建快閃記憶體型
ML226xx系列是語音合成LSI，具備4Mbit至32Mbit的快閃記憶體。
大容量的記憶體非常適合長時間的音訊播放，例如語音導覽。快閃記憶體可輕鬆重寫音訊資料，也具備從MCU重寫聲音資料的功能。
採用可實現高品質音效的HQ-ADPCM、16位元D/A轉換器和低通濾波器，並內建可直接驅動喇叭的1.0W單聲道喇叭放大器。
由於音訊輸出所需的各項功能整合在單晶片中，只需追加本LSI即可輕鬆實現音訊功能。
Product Detail
規格:
Operating Voltage [V]
2.7 to 3.6 or 3.3 to 5.5
Operating Frequency [MHz]
4.096
4.000
Oscillator
Built-in
External
Operating Temperature (Min.)[°C]
-40
Operating Temperature (Max.)[°C]
70
ROM Capacity [bit]
Flash
32M
Number of Phrases ?
4096
Maximum Playback Time ?
27min *1
CPU I/F
I2C
SP Amplifier Output [W] / Class
1.0/AB-class,
D-class
Number of Mixing (Internal) [ch]
4
Others
Failure detection
Automotive Grade
No
AEC-Q100 standard
No
Industrial Grade
Yes
Development Support
-
- Reference Board
- RB-S22Q66xTB32
- Supply Status
- Recommended
- Supporuted LSI
- ML22Q663
- ML22Q664
- ML22Q665
- ML22Q666
- Composition
- Reference board with TQFP32 socket
- User's Manual
- Notes
- Used by connecting to SDCB3.
-
- Reference Board
- RB-S22Q66xGD32
- Supply Status
- Recommended
- Supporuted LSI
- ML22Q663
- ML22Q664
- ML22Q665
- ML22Q666
- Composition
- Reference board with WQFN32 socket
- User's Manual
- Notes
- Used by connecting to SDCB3.
-
- Development Kit
- SDCK3
- Supply Status
- Recommended
- Supporuted LSI
- ML22530, Q532, Q533, Q535
- ML22620, Q623, Q624, Q625, Q626
- ML22660, Q663, Q664, Q665, Q666
- ML22Q234, Q244, Q254
- ML22Q274, Q284, Q294
- ML22572, 573, Q573, Q553, ML22594
- ML22Q374, Q394
- ML22562, 563, Q563
- ML22823, 824, 825
- ML22863, 864, 865
- Composition
- Sound device control board 3 [SDCB3]
- USB cable
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