新設計不推薦

BD6383EFV

High Performance, High Reliability 36V Series Stepping Motor Driver

Data Sheet

BD6383EFV

新設計不推薦 BD6383EFV
High Performance, High Reliability 36V Series Stepping Motor Driver

為了既有客戶所需而生產的產品。對於新設計則不予販售。

Data Sheet

Product Detail

料號 | BD6383EFV-E2

狀態 | 新設計不推薦

封裝 | HTSSOP-B40

包裝形式 | Taping

單位數量 | 2000

最小包裝數量 | 2000

RoHS | Yes

規格:

Power Supply Voltage (Max.) [V]

Power Supply Voltage (Min.) [V]

Vcc (Max.)[V]

Iout (Max.)[A]

Output On Resistance (Typ.)[Ω]

1.5

Step

to 1 / 4

MIX DECAY Function

Yes

Single power supply input

Yes

Automotive class

Interface

CLK / PARA-IN

Operating Temperature (Min.)[°C]

-25

Operating Temperature (Max.)[°C]

Package Size [mm]

13.6x7.8 (t=1.0)

功能:

・低Rds ON DMOS、額定電流1.0A
・CLK-IN/PARALLEL-IN可以切換
・對應QUARTER STEP
・對應外接DACμ-step
・省電功能
・溫度保護電路(TSD電路)
・過電流保護電路(OCP)
・低電壓保護電路(UVLO)
・過電壓時輸出OFF功能(OVLO)
・POWER ON重置功能
・小型・超薄・高散熱（背面散熱型）HTSSOP封裝
・電流衰減方式切換功能（Mix decay）
・電源單系統驅動36V
・引腳相容產品系列（（BD6387EFV/BD6385EFV/BD6383EFV）

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Type	Title	Last Updated
Data Sheet	BD6383EFV Data Sheet	2012/08/20

Title	Description
No data available in table

Technical Articles

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Type	Title	Last Updated
Technical Article	Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)	2025/04/16
White Paper	Five Steps for Successful Thermal Design of IC	2024/09/13
Thermal Design	Solder Joint Rate and Thermal Resistance of Exposed Pad	2024/07/05
Thermal Design	Thermal Resistance	2024/03/19
Thermal Design	Judgment Criteria of Thermal Evaluation	2023/03/08
Thermal Design	How to Use the Thermal Resistance and Thermal Characteristics Parameters	2023/02/24
Thermal Design	θ_JA and Ψ_JT	2023/02/13
Thermal Design	θ_JC and Ψ_JT	2023/01/20
Thermal Design	PCB Layout Thermal Design Guide	2022/07/12
Thermal Design	Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package	2022/07/08
Thermal Design	Design Guide and Example of Stencil for Exposed Pad	2021/11/19
Thermal Design	Basics of Thermal Resistance and Heat Dissipation	2021/08/18
Thermal Design	What Is Thermal Design	2021/06/24
Thermal Design	Method for Calculating Junction Temperature from Transient Thermal Resistance Data	2021/06/14
Thermal Design	Precautions When Measuring the Rear of the Package with a Thermocouple	2020/10/26
Schematic Design & Verification	Impedance Characteristics of Bypass Capacitor	2020/09/16
Thermal Design	Two-Resistor Model for Thermal Simulation	2020/04/09

Type	Title	Last Updated
No data available in table

Tools

Type	Title	Last Updated
2D/3D/CAD	HTSSOP-B40 Footprint / Symbol	2021/03/03

Packaging & Quality

Search:

Type	Title	Last Updated
Package Information	HTSSOP-B40 Package Information	2020/02/27
Package Information	Anti-Whisker formation	2016/10/11
Environmental Data	Compliance with the ELV directive	2016/10/11
Environmental Data	UL94 Flame Classifications of Mold Compound	2016/10/11
Manufacturing Data	Factory Information	2016/09/30

BD6383EFV

新設計不推薦 BD6383EFV
High Performance, High Reliability 36V Series Stepping Motor Driver

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