2D/3D/CAD
- TSSOP-B8 Footprint / Symbol
BR25G640FVT-3
BR25G640FVT-3
SPI BUS EEPROM
BR25G640FVT-3是64kbit SPI BUS介面的序列EEPROM。
Product Detail
規格:
Series
BR25G-3
Grade
Standard
I/F
SPI BUS
Density [bit]
64k
Bit Format [Word x Bit]
8k x 8
Package
TSSOP-B8
Package Size [mm]
3x6.4(t=1.2)
Operating Temperature (Min.)[°C]
-40
Operating Temperature (Max.)[°C]
85
Vcc(Min.)[V]
1.6
Vcc(Max.)[V]
5.5
Circuit Current (Max.)[mA]
8.0
Standby Current (Max.)[μA]
2.0
Write Cycle (Max.)[ms]
5.0
Input Frequency (Max.)[Hz]
20M
Endurance (Max.)[Cycle]
106
Data Retention (Max.)[Year]
100
功能:
· High Speed Clock Action up to 20MHz (Max)· Wait Function by HOLDB Terminal
· Part or Whole of Memory Arrays Settable as Read only Memory Area by Program
· 1.6V to 5.5V Single Power Source Operation Most Suitable for Battery Use.
· Up to 32 Bytes in Page Write Mode.
· For SPI Bus Interface (CPOL, CPHA) = (0, 0), (1, 1)
· Self-timed Programming Cycle
· Low Current Consumption
· Address Auto Increment Function at Read Action
· Prevention of Write Mistake
· More than 100 years Data Retention.
· More than 1 Million Write Cycles.
· Bit Format 8K×8
· Initial Delivery Data
Design Resources
Technical Articles
Schematic Design & Verification
- Opcode, Address, and Page Configuration for SPI BUS EEPROM
- Impedance Characteristics of Bypass Capacitor
Thermal Design
- What Is Thermal Design
- Method for Calculating Junction Temperature from Transient Thermal Resistance Data
- Thermal Resistance
Tools
2D/3D/CAD
- TSSOP-B8 Footprint / Symbol
Packaging & Quality
Package Information
- Package Information
- Anti-Whisker formation
Manufacturing Data
- Factory Information
Environmental Data
- UL94 Flame Classifications of Mold Compound
- Compliance with the ELV directive
- REACH SVHC Non-use Declaration
- RoHS Comission Delegated Directive
Export Information
- The Export Control Order
- Export Administration Regulations(EAR)