BR93H56RFVT-2C
車用 Microwire BUS 2kbit(128x16bit) EEPROM

BR93H56-2C是序列3線式介面方式的序列EEPROM。

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Product Detail

 
料號 | BR93H56RFVT-2CE2
狀態 | 推薦品
封裝 | TSSOP-B8
單位數量 | 3000
最小包裝數量 | 3000
包裝形式 | Taping
RoHS | Yes

功能安全:

類別 : FS supportive
A product that has been developed for automotive use and is capable of supporting safety analysis with regard to the functional safety.
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規格:

Series

BR93H-2C

Grade

Automotive

I/F

MicroWire BUS(3-Wire)

Density [bit]

2k

Bit Format [Word x Bit]

128 x 16

Package

TSSOP-B8

Package Size [mm]

3x6.4 (t=1.2)

Operating Temperature (Min.)[°C]

-40

Operating Temperature (Max.)[°C]

125

Vcc(Min.)[V]

2.5

Vcc(Max.)[V]

5.5

Circuit Current (Max.)[mA]

3.0

Standby Current (Max.)[μA]

10.0

Write Cycle (Max.)[ms]

4.0

Input Frequency (Max.)[Hz]

2M

Endurance (Max.)[Cycle]

106

Data Retention (Max.)[Year]

100

功能:

・ Conforming to Microwire BUS
・ Withstands electrostatic voltage 6kV (HBM method typ.）
・ Wide temperature range -40℃ to +125℃ (-40℃ to +85℃, -40℃ to +105℃ in other series）
・ Same package line up and same pin configuration
・ 2.5V to 5.5V single supply voltage operation
・ Address auto increment function at read operation
・ Write mistake prevention function Write prohibition at power on Write prohibition by command code Write mistake prevention circuit at low voltage
・ Program cycle auto erase and auto end function
・ Program condition display by READY / BUSY
・ Low current consumption At write operation (at 5V) : 0.8mA (Typ.) At read operation (at 5V) : 0.5mA (Typ.) At standby operation (at 5V) : 0.1μA (Typ.) (CMOS input)
・ Compact package MSOP8 / TSSOP-B8 / SOP8 / SOP-J8
・ High reliability by ROHM original Double-Cell structure
・ Data retention for 20 years(Ta≦125℃)
・ Endurance up to 300,000 cycles(Ta≦125℃)
・ Data at shipment all address FFFFh
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Design Resources

 

Documents

Application Note

  • Difference between BR93HR-2C and BR93HR-WC

Technical Articles

Schematic Design & Verification

  • Impedance Characteristics of Bypass Capacitor

Thermal Design

  • What Is Thermal Design
  • Basics of Thermal Resistance and Heat Dissipation
  • Method for Calculating Junction Temperature from Transient Thermal Resistance Data
  • Thermal Resistance

Tools

2D/3D/CAD

  • TSSOP-B8 Footprint / Symbol

Packaging & Quality

Package Information

  • Package Information
  • Anti-Whisker formation

Manufacturing Data

  • Factory Information

Environmental Data

  • UL94 Flame Classifications of Mold Compound
  • Compliance with the ELV directive
  • REACH SVHC Non-use Declaration
  • RoHS Comission Delegated Directive

Export Information

  • The Export Control Order
  • Export Administration Regulations(EAR)