UFZV30B

Design Resources

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Documents

Type	Title	Last Updated
Data Sheet	UFZV30B Data Sheet	2017/01/22
Application Note	Part Explanation	2024/12/03

Title	Description
No data available in table

Technical Articles

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Type	Title	Last Updated
Technical Article	Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)	2025/04/16
Schematic Design & Verification	How to Use LTspice® Models	2025/03/06
Schematic Design & Verification	Method for Monitoring Switching Waveform	2024/06/04
Thermal Design	Power Loss and Thermal Design of Diodes	2024/05/10
Schematic Design & Verification	How to Select Reverse Current Protection Diodes for LDO Regulators	2024/02/13
Technical Article	What Are TVS Diodes?	2024/01/26
Technical Article	Selection Method and Usage of TVS Diodes	2024/01/15
Schematic Design & Verification	PCB Layout for TVS Diodes	2024/01/15
Technical Article	Differences between TVS and Zener Diodes	2023/12/18
Technical Article	Absolute Maximum Rating and Electrical Characteristics of Diodes	2023/12/18
Technical Article	Diode Types and Applications	2023/11/17
Thermal Design	List of Diode Package Thermal Resistance	2023/06/08
Thermal Design	Judgment Criteria of Thermal Evaluation	2023/03/08
Thermal Design	How to Use the Thermal Resistance and Thermal Characteristics Parameters	2023/02/24
Thermal Design	θ_JA and Ψ_JT	2023/02/13
Schematic Design & Verification	Low-Side Current Sensing Circuit Design	2023/02/13
Thermal Design	θ_JC and Ψ_JT	2023/01/20
Schematic Design & Verification	How to Use LTspice® Models: Tips for Improving Convergence	2023/01/11
Thermal Design	Measurement Method and Usage of Thermal Resistance RthJC	2022/09/15
Thermal Design	PCB Layout Thermal Design Guide	2022/07/12
Thermal Design	Notes for Calculating Power Consumption:Static Operation	2022/07/06
Thermal Design	Basics of Thermal Resistance and Heat Dissipation	2021/08/18
Thermal Design	What Is Thermal Design	2021/06/24
Thermal Design	Method for Calculating Junction Temperature from Transient Thermal Resistance Data	2021/06/14
Schematic Design & Verification	Importance of Probe Calibration When Measuring Power: Deskew	2020/12/07
Thermal Design	Precautions When Measuring the Rear of the Package with a Thermocouple	2020/10/26
Schematic Design & Verification	Impedance Characteristics of Bypass Capacitor	2020/09/16
Thermal Design	Notes for Temperature Measurement Using Forward Voltage of PN Junction	2020/04/20
Thermal Design	Notes for Temperature Measurement Using Thermocouples	2020/04/09
Thermal Design	Two-Resistor Model for Thermal Simulation	2020/04/09
Thermal Design	What is a Thermal Model? (Diode)	2019/12/27

Type	Title	Last Updated
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Tools

Type	Title	Last Updated
Models	UFZV30B LTspice Model	2022/12/08
Models	UFZV30B SPICE Model	2021/11/29
2D/3D/CAD	UMD2 STEP Data	2020/07/09
2D/3D/CAD		-

Packaging & Quality

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Type	Title	Last Updated
Environmental Data	Compliance of the RoHS directive	2025/05/28
Environmental Data	ICP/SGS UMD2(UMD2M) HF	2025/05/28
Environmental Data	REACH SVHC247-A-2501-DI	2025/05/28
Environmental Data	UMD2(UMD2M) HF Constitution List	2025/05/28
Environmental Data	UMD2(UMD2M) HF chemSHERPA	2025/05/28
Package Information	Anti-Whisker formation - Diodes	2025/04/22
Package Information	Moisture Sensitivity Level - Diodes	2025/04/22
Manufacturing Data	Reliability Test Result	2025/04/18
Environmental Data	About Flammability of Materials	2016/09/30
Package Information	Condition of Soldering / Land Pattern Reference	2016/09/27
Package Information	Explanation for Marking	2016/09/27
Package Information	Taping Information	2016/09/27
Package Information	Inner Structure	2016/09/27
Package Information	Package Dimensions	2016/09/27
Export Information	About Export Regulations	2016/09/27

UFZV30B
齊納二極體

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UFZV30B 齊納二極體

Product Detail

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Different Grade

Design Resources

Documents

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Tools

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Most Viewed

UFZV30B
齊納二極體