Models
- UDZV39B SPICE Model
- UDZV39B Thermal Model (lib)
- How to Create Symbols for PSpice Models
2D/3D/CAD
- UMD2 STEP Data
Characteristics Data
- ESD Data
UDZV39B
Product Detail
規格:
Grade
Standard
Configuration
Single
Package Code
SOD-323FL
Package(JEITA)
SC-90A
Mounting Style
Surface mount
Number of terminal
2
Power Dissipation (PD)[mW]
200
Zener Voltage VZ (Min.)[V]
38.02
Zener Voltage VZ (Max.)[V]
39.98
IZ @ VZ [mA]
2
Storage Temperature (Min.)[°C]
-55
Storage Temperature (Max.)[°C]
150
Package Size [mm]
2.5x1.25 (t=0.7)
功能:
・超小型化2端子Mini Mold高可靠性安裝類型。・高可靠性。
・可藉由元件安裝機台完成元件自動安裝。
Design Resources
Technical Articles
Schematic Design & Verification
- Low-Side Current Sensing Circuit Design
- Method for Monitoring Switching Waveform
- Importance of Probe Calibration When Measuring Power: Deskew
- Impedance Characteristics of Bypass Capacitor
Thermal Design
- What Is Thermal Design
- Method for Calculating Junction Temperature from Transient Thermal Resistance Data
- Notes for Temperature Measurement Using Thermocouples
- Two-Resistor Model for Thermal Simulation
- Notes for Temperature Measurement Using Forward Voltage of PN Junction
- What is a Thermal Model? (Diode)
- Measurement Method and Usage of Thermal Resistance RthJC
- Precautions When Measuring the Rear of the Package with a Thermocouple
Tools
Models
- UDZV39B SPICE Model
- UDZV39B Thermal Model (lib)
- How to Create Symbols for PSpice Models
2D/3D/CAD
- UMD2 STEP Data
Characteristics Data
- ESD Data
Packaging & Quality
Package Information
- Package Dimensions
- Inner Structure
- Taping Information
- Explanation for Marking
- Moisture Sensitivity Level
- Anti-Whisker formation
- Condition of Soldering
Manufacturing Data
- Reliability Test Result
Environmental Data
- Constitution Materials List
- About Flammability of Materials
- About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
- Compliance of the RoHS / ELV directive
Export Information
- About Export Regulations