Models
- TFZV30B SPICE Model
- TFZV30B Thermal Model (lib)
2D/3D/CAD
- TUMD2M STEP Data
Characteristics Data
- ESD Data
TFZV30B
Product Detail
規格:
Grade
Standard
Configuration
Single
Package Code
SOD-323HE
Package(JEITA)
SC-108B
Package Size[mm]
2.5x1.4 (t=0.6)
Mounting Style
Surface mount
Number of terminal
2
Power Dissipation (PD)[mW]
500
Zener Voltage VZ (Min.)[V]
27.7
Zener Voltage VZ (Max.)[V]
29.13
IZ @ VZ [mA]
5
Storage Temperature (Min.)[°C]
-55
Storage Temperature (Max.)[°C]
150
功能:
- Small power mold type (TUMD2M)
- High reliability
- Automatic mounting is possible by chip-mounter
Design Resources
Technical Articles
Schematic Design & Verification
- Method for Monitoring Switching Waveform
- Importance of Probe Calibration When Measuring Power: Deskew
- Impedance Characteristics of Bypass Capacitor
Thermal Design
- Notes for Temperature Measurement Using Thermocouples
- Two-Resistor Model for Thermal Simulation
- Notes for Temperature Measurement Using Forward Voltage of PN Junction
- What is a Thermal Model? (Diode)
- Measurement Method and Usage of Thermal Resistance RthJC
- Precautions When Measuring the Rear of the Package with a Thermocouple
Tools
Models
- TFZV30B SPICE Model
- TFZV30B Thermal Model (lib)
2D/3D/CAD
- TUMD2M STEP Data
Characteristics Data
- ESD Data
Packaging & Quality
Package Information
- Package Dimensions
- Inner Structure
- Taping Information
- Explanation for Marking
- Moisture Sensitivity Level
- Anti-Whisker formation
- Condition of Soldering
Manufacturing Data
- Reliability Test Result
Environmental Data
- Constitution Materials List
- About Flammability of Materials
- About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
- Compliance of the RoHS / ELV directive
Export Information
- About Export Regulations