Models
- TFZV30B SPICE Model
- TFZV30B Thermal Model (lib)
- How to Create Symbols for PSpice Models
2D/3D/CAD
- TUMD2M STEP Data
TFZV30B
Product Detail
規格:
Grade
Standard
Configuration
Single
Package Code
SOD-323HE
Package(JEITA)
SC-108B
Mounting Style
Surface mount
Number of terminal
2
Power Dissipation (PD)[mW]
500
Zener Voltage VZ (Min.)[V]
27.7
Zener Voltage VZ (Max.)[V]
29.13
IZ @ VZ [mA]
5
Storage Temperature (Min.)[°C]
-55
Storage Temperature (Max.)[°C]
150
Package Size [mm]
1.4x2.5 (t=0.8)
功能:
- Small power mold type (TUMD2M)
- High reliability
- Automatic mounting is possible by chip-mounter
Design Resources
Documents
Data Sheet
Technical Articles
Schematic Design & Verification
Thermal Design
- What Is Thermal Design
- Basics of Thermal Resistance and Heat Dissipation
- Method for Calculating Junction Temperature from Transient Thermal Resistance Data
- Notes for Temperature Measurement Using Thermocouples
- Two-Resistor Model for Thermal Simulation
- Notes for Temperature Measurement Using Forward Voltage of PN Junction
- What is a Thermal Model? (Diode)
- Measurement Method and Usage of Thermal Resistance RthJC
- Precautions When Measuring the Rear of the Package with a Thermocouple
Tools
Models
- TFZV30B SPICE Model
- TFZV30B Thermal Model (lib)
- How to Create Symbols for PSpice Models
2D/3D/CAD
- TUMD2M STEP Data